XC7A75T-1FTG256I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 170 3870720 75520 256-LBGA |
|---|---|
| Quantity | 578 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 170 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5900 | Number of Logic Elements/Cells | 75520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3870720 |
Overview of XC7A75T-1FTG256I – Artix-7 Field Programmable Gate Array (FPGA) IC 170 I/Os 75,520 Logic Elements 256-LBGA
The XC7A75T-1FTG256I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 256-LBGA surface-mount package. It delivers 75,520 logic elements across 5,900 CLBs with approximately 3.87 Mbits of embedded RAM and 170 general purpose I/Os.
Designed for industrial-grade operation, this device operates from a core voltage range of 0.95 V to 1.05 V and supports an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require mid-range logic capacity and robust temperature performance.
Key Features
- Logic Fabric 75,520 logic elements implemented across 5,900 CLBs for mid-range programmable logic capacity.
- Embedded Memory Approximately 3.87 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
- I/O Count 170 general purpose I/Os to enable flexible interfacing with external peripherals and subsystems.
- Power Core voltage supply specified from 0.95 V to 1.05 V to match target power-rail requirements.
- Package & Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for compact board integration.
- Temperature Grade Industrial-grade operation with an operating temperature range of −40 °C to 100 °C.
- Regulatory RoHS compliant.
Unique Advantages
- Substantial logic density: 75,520 logic elements and 5,900 CLBs enable integration of sizeable FPGA functions without moving to larger families.
- On-chip memory availability: Approximately 3.87 Mbits of RAM supports local data buffering and memory-intensive logic tasks, reducing dependence on external memory.
- Flexible I/O: 170 I/Os provide broad connectivity options for interfacing with multiple peripherals and subsystems on a single device.
- Industrial temperature support: Rated for −40 °C to 100 °C operation to meet the thermal needs of industrial applications.
- Compact surface-mount packaging: 256-LBGA (256-FTBGA, 17×17) enables dense board layouts while maintaining a standardized package footprint.
- Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports lower-power FPGA implementations where applicable.
Why Choose XC7A75T-1FTG256I?
The XC7A75T-1FTG256I positions itself as a mid-range Artix-7 FPGA that balances logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across a wide thermal range.
This device is well suited for engineers and teams needing a robust, surface-mount FPGA solution with substantial programmable logic, embedded RAM, and flexible I/O count—providing a stable building block for industrial and embedded system designs.
Request a quote or submit an inquiry to receive pricing, availability, and ordering details for the XC7A75T-1FTG256I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








