XC7A75T-1FTG256I

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 3870720 75520 256-LBGA

Quantity 578 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-1FTG256I – Artix-7 Field Programmable Gate Array (FPGA) IC 170 I/Os 75,520 Logic Elements 256-LBGA

The XC7A75T-1FTG256I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 256-LBGA surface-mount package. It delivers 75,520 logic elements across 5,900 CLBs with approximately 3.87 Mbits of embedded RAM and 170 general purpose I/Os.

Designed for industrial-grade operation, this device operates from a core voltage range of 0.95 V to 1.05 V and supports an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require mid-range logic capacity and robust temperature performance.

Key Features

  • Logic Fabric  75,520 logic elements implemented across 5,900 CLBs for mid-range programmable logic capacity.
  • Embedded Memory  Approximately 3.87 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Count  170 general purpose I/Os to enable flexible interfacing with external peripherals and subsystems.
  • Power  Core voltage supply specified from 0.95 V to 1.05 V to match target power-rail requirements.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for compact board integration.
  • Temperature Grade  Industrial-grade operation with an operating temperature range of −40 °C to 100 °C.
  • Regulatory  RoHS compliant.

Unique Advantages

  • Substantial logic density: 75,520 logic elements and 5,900 CLBs enable integration of sizeable FPGA functions without moving to larger families.
  • On-chip memory availability: Approximately 3.87 Mbits of RAM supports local data buffering and memory-intensive logic tasks, reducing dependence on external memory.
  • Flexible I/O: 170 I/Os provide broad connectivity options for interfacing with multiple peripherals and subsystems on a single device.
  • Industrial temperature support: Rated for −40 °C to 100 °C operation to meet the thermal needs of industrial applications.
  • Compact surface-mount packaging: 256-LBGA (256-FTBGA, 17×17) enables dense board layouts while maintaining a standardized package footprint.
  • Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports lower-power FPGA implementations where applicable.

Why Choose XC7A75T-1FTG256I?

The XC7A75T-1FTG256I positions itself as a mid-range Artix-7 FPGA that balances logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across a wide thermal range.

This device is well suited for engineers and teams needing a robust, surface-mount FPGA solution with substantial programmable logic, embedded RAM, and flexible I/O count—providing a stable building block for industrial and embedded system designs.

Request a quote or submit an inquiry to receive pricing, availability, and ordering details for the XC7A75T-1FTG256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up