XC7A75T-2FGG484C

The XC7A75T-2FGG484C is an AMD Artix-7 Field Programmable Gate Array (FPGA) in a 484-ball BGA package, designed for commercial electronic applications. It provides a balance of programmable logic density, on-chip embedded memory, and I/O capacity for a wide range of custom digital designs.

Key on-chip resources include 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and 285 I/O pins. The device operates from 0.95 V to 1.05 V and is specified for commercial temperatures from 0°C to 85°C. The package is a 484-ball BGA (supplier device package: 484-FBGA, 23×23) with surface-mount mounting and RoHS compliance.

Key Features

• Programmable Logic Core  Provides 75,520 logic elements for implementing custom digital logic and control functions.
• Logic Cells / CLBs  Contains 5,900 logic cells that enable structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 3.87 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage for datapaths.
• I/O Capacity  285 I/O pins to support a variety of peripheral interfaces and board-level connectivity requirements.
• Power Supply Range  Core supply voltage specified from 0.95 V to 1.05 V to match system power rails and voltage planning.
• Package and Mounting  484-ball BGA package (supplier designation 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Operating Temperature  Commercial temperature grade rated from 0°C to 85°C for standard commercial deployments.
• Environmental Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Commercial electronic systems  Implement custom control and glue logic in consumer and industrial-grade equipment using the device’s logic density and I/O count.
• High-density digital designs  Build medium-to-large digital subsystems that require significant programmable logic and embedded RAM for buffering and data manipulation.
• Board-level integration  Use the 484-ball BGA package and surface-mount mounting to integrate the FPGA into compact PCB layouts with substantial I/O routing.

Unique Advantages

• Substantial logic capacity: 75,520 logic elements enable complex custom logic implementations without external gate arrays.
• On-chip memory for datapaths: Approximately 3.87 Mbits of embedded RAM reduces the need for external memory in many buffering and temporary-storage use cases.
• High I/O availability: 285 I/O pins allow direct interfacing to multiple peripherals and board-level signals, simplifying system partitioning.
• Compact BGA packaging: 484-ball BGA (23×23) supports dense board layouts while providing the connectivity needed for complex systems.
• Commercial-grade specification: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial product lifecycles and manufacturing requirements.

Why Choose XC7A75T-2FGG484C?

The XC7A75T-2FGG484C positions itself as a capable Artix-7 FPGA option for commercial designs that need a combination of programmable logic density, embedded RAM, and substantial I/O in a compact BGA package. Its specifications support integration into systems where on-chip resources and board-level connectivity are primary considerations.

This part is suited to designers and procurement teams building medium-to-large custom digital subsystems who require verifiable device parameters—logic elements, embedded memory, I/O count, supply voltage range, package, and commercial temperature rating—for planning and BOM definition.

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