XC7A75T-2FGG676C

The XC7A75T-2FGG676C is an Artix-7 Field Programmable Gate Array (FPGA) IC provided in a 676-BGA package. It delivers a balance of programmable logic, embedded memory, and I/O capacity for commercial-grade applications that require configurable logic and flexible interface options.

With a core supply range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C, this surface-mount FPGA is suited for designs where on-chip memory, a sizable logic fabric, and a high I/O count are required.

Key Features

• Logic Capacity  Approximately 75,520 logic elements (logic cells) for implementing custom digital functions and state machines.
• Configurable Logic Blocks  5,900 programmable CLB (configurable logic block) units available for partitioning and mapping complex logic architectures.
• Embedded Memory  Approximately 3.87 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage.
• I/O Density  300 general-purpose I/O pins to interface with external devices, sensors, and peripherals.
• Power  Core voltage supply requirement: 0.95 V to 1.05 V to match system power rails and regulator designs.
• Package & Mounting  676-ball FBGA package (676-FBGA, 27 × 27) in a surface-mount form factor for compact PCB layouts.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, aligned with commercial-grade deployment environments.
• Regulatory  RoHS-compliant material status for environmentally conscious assembly and compliance requirements.

Typical Applications

• High-density I/O systems  Use the 300 I/O pins to connect multiple peripherals, sensors, or parallel interfaces in compact designs.
• Embedded logic and control  Implement custom control logic, state machines, and protocol handling using the FPGA's logic elements and CLBs.
• On-chip buffering and data handling  Leverage approximately 3.87 Mbits of embedded RAM for local buffering, FIFO implementation, and temporary data storage.

Unique Advantages

• Substantial logic resources: Approximately 75,520 logic elements and 5,900 CLBs provide capacity for complex logic implementations without immediate need for external devices.
• Generous embedded memory: Approximately 3.87 Mbits of on-chip RAM reduces dependence on off-chip memory for many buffering and storage tasks.
• High I/O count: 300 I/Os simplify system integration by supporting multiple parallel interfaces and peripheral connections.
• Compact, manufacturable package: 676-FBGA (27 × 27) surface-mount package enables dense PCB placement while supporting automated assembly processes.
• Commercial operating range: 0 °C to 85 °C rating and RoHS compliance align the device to standard commercial product lifecycles and regulatory needs.

Why Choose XC7A75T-2FGG676C?

The XC7A75T-2FGG676C positions itself as a flexible, commercial-grade FPGA option that combines a large logic fabric, significant on-chip memory, and broad I/O capacity in a compact 676-BGA package. It is well suited for engineers designing compact systems that require programmable logic, local memory, and multiple external interfaces.

Choosing this part offers scalability for evolving designs and straightforward integration into commercial products that operate within a 0 °C to 85 °C range and adhere to RoHS requirements.

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