XC7A75T-2FTG256I

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 3870720 75520 256-LBGA

Quantity 1,830 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-2FTG256I – Artix-7 Field Programmable Gate Array (FPGA) IC 170 3870720 75520 256-LBGA

The XC7A75T-2FTG256I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD in a 256-LBGA surface-mount package. It combines significant programmable logic capacity with on-chip memory and a substantial I/O count to support industrial embedded designs.

Key on-device resources include 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and 170 I/O pins, while the device is specified for operation from -40 °C to 100 °C and a core voltage supply range of 0.95 V to 1.05 V.

Key Features

  • Core Logic 75,520 logic elements and 5,900 logic blocks provide programmable logic capacity for complex designs.
  • Embedded Memory Approximately 3.87 Mbits of on-chip RAM for buffering, state storage, and custom memory structures.
  • High I/O Count 170 user I/O pins to interface with peripherals, sensors, and external devices.
  • Package & Mounting 256-LBGA (supplier package: 256-FTBGA 17×17) in a surface-mount form factor for compact board designs.
  • Power Core voltage supply specified from 0.95 V to 1.05 V for predictable power planning and supply design.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet industrial ambient requirements.
  • Regulatory Compliance RoHS-compliant construction to support regulatory and manufacturing requirements.

Unique Advantages

  • Significant Logic Capacity: 75,520 logic elements support large-scale programmable designs and implementation of complex algorithms.
  • Integrated Memory Resources: Approximately 3.87 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path applications.
  • Generous I/O Availability: 170 I/O pins enable broad interfacing options for mixed-signal front ends, sensors, and high-channel-count systems.
  • Industry-Grade Thermal Range: Specified -40 °C to 100 °C operation supports deployment in industrial environments with wider temperature swings.
  • Compact Surface-Mount Package: 256-LBGA (256-FTBGA 17×17) provides a space-efficient footprint for dense PCB layouts.
  • Manufacturer Provenance: Supplied by AMD, aligning the device with an established FPGA product family.

Why Choose XC7A75T-2FTG256I?

The XC7A75T-2FTG256I positions itself as a capable industrial-grade Artix-7 FPGA that balances substantial logic and memory resources with a high I/O count in a compact 256-LBGA package. Its voltage and temperature specifications support predictable integration into power- and environment-constrained embedded systems.

This device is suited to designers and procurement teams seeking a programmable logic component from AMD that offers scalability of logic and memory resources within a board-space-efficient, RoHS-compliant package for industrial applications.

Request a quote or submit an inquiry for pricing and availability of the XC7A75T-2FTG256I to evaluate it for your next design.

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