XC7A75T-3FGG484E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 285 3870720 75520 484-BBGA |
|---|---|
| Quantity | 1,035 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5900 | Number of Logic Elements/Cells | 75520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3870720 |
Overview of XC7A75T-3FGG484E – Artix-7 Field Programmable Gate Array (FPGA)
The XC7A75T-3FGG484E is an AMD Artix-7 Field Programmable Gate Array supplied in a 484-BBGA package. It provides 75,520 logic elements and approximately 3.87 Mbits of embedded memory for programmable logic implementations.
Designed with 285 user I/O, a supply range of 950 mV to 1.05 V, and an extended-grade rating with an operating temperature range of 0°C to 100°C, this device suits compact, I/O‑rich FPGA designs that require on-chip memory and significant logic capacity in a 484‑FBGA (23×23) footprint.
Key Features
- Core Logic 75,520 logic elements provide substantial programmable resources for implementing custom digital logic and state machines.
- Embedded Memory Approximately 3.87 Mbits of on‑chip RAM support buffering, temporary storage, and local data processing without external memory.
- Flexible I/O 285 user I/O pins enable broad interfacing options for multiple peripherals, buses, and custom I/O standards.
- Power Supply Operates from a core voltage supply range of 950 mV to 1.05 V to match system power architectures that support the Artix‑7 family.
- Package & Mounting 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for high‑density PCB integration.
- Temperature & Grade Extended grade device with an operating temperature range of 0°C to 100°C for designs requiring above‑commercial temperature coverage.
- Regulatory Compliance RoHS compliant.
Typical Applications
- FPGA-based system integration — Implement custom logic, protocol bridging, and interface conversion using the device’s large logic fabric and abundant I/O.
- Real-time data buffering and processing — On‑chip memory and logic elements enable local data handling and temporary storage for streaming data paths.
- Prototyping and development platforms — Compact 484‑FBGA footprint and high I/O count make the device suitable for evaluation boards and reference designs.
- Embedded control and I/O aggregation — Combine programmable logic and numerous I/O to consolidate control functions and peripheral interfaces.
Unique Advantages
- High logic capacity: 75,520 logic elements enable complex designs and multiple concurrent functions on a single device.
- Substantial on‑chip memory: Approximately 3.87 Mbits of embedded RAM reduces dependence on external memory for buffering and data staging.
- Extensive I/O: 285 user I/O pins provide flexibility to connect numerous peripherals and interfaces without external multiplexing.
- Compact, industry-standard package: 484‑FBGA (23×23) offers a dense, surface‑mount solution for space-constrained PCBs.
- Extended-grade temperature range: Rated 0°C to 100°C to meet designs that require operation beyond typical commercial limits.
- RoHS compliant: Meets environmental compliance requirements for lead‑free manufacturing processes.
Why Choose XC7A75T-3FGG484E?
The XC7A75T-3FGG484E positions itself as a flexible Artix‑7 FPGA option for designers who need a balance of sizable logic resources, on‑chip memory, and a high I/O count in a compact FBGA package. Its extended-grade rating and clearly defined voltage and temperature ranges make it suitable for a wide range of embedded and system‑level FPGA implementations.
Backed by AMD’s Artix‑7 documentation, this device is a practical choice for teams developing FPGA-based prototypes, custom data paths, or control logic that require scalable logic capacity and local memory while maintaining a small board footprint.
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