XC7A75T-L2FGG484E

IC FPGA 285 I/O 484FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 3870720 75520 484-BBGA

Quantity 1,994 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-L2FGG484E – Artix-7 FPGA, 484-BBGA

The XC7A75T-L2FGG484E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD built in a 484-ball BGA package. It combines configurable logic resources, embedded on-chip memory, and a substantial I/O count in a surface-mount 484-BBGA (supplier: 484-FBGA, 23×23) footprint.

Key on-chip attributes include 5,900 CLBs, 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and 285 I/O pins. The device operates from a core supply range of 950 mV to 1.05 V and is available in an extended grade with an ambient operating range of 0 °C to 100 °C.

Key Features

  • Core Logic — 5,900 CLBs and 75,520 logic elements provide a sizable pool of programmable resources for RTL implementation and custom logic functions.
  • Embedded Memory — Approximately 3.87 Mbits of on-chip RAM for buffering, FIFOs, and data storage without external memory.
  • I/O Capacity — 285 user I/O pins to support multiple parallel interfaces and board-level connectivity requirements.
  • Power — Core voltage supply specified from 950 mV to 1.05 V to match system power-rail planning and supply design.
  • Package & Mounting — 484-ball BGA (484-BBGA / 484-FBGA, 23×23) in a surface-mount format for compact board-level integration.
  • Temperature & Grade — Extended-grade device rated for 0 °C to 100 °C ambient operation.
  • Environmental Compliance — RoHS compliant for regulatory alignment in lead-free assemblies.

Unique Advantages

  • High logic capacity: 75,520 logic elements and 5,900 CLBs enable complex custom logic implementations on a single device, reducing the need for multiple discrete devices.
  • Integrated memory: Approximately 3.87 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
  • Generous I/O count: 285 I/O pins support diverse peripheral and parallel interface requirements without adding external multiplexers.
  • Compact packaging: 484-ball BGA (23×23) allows dense PCB integration while keeping a broad feature set in a single package.
  • Wide supply compatibility: Core supply range of 950 mV to 1.05 V aligns with common low-voltage FPGA power architectures.
  • Regulatory readiness: RoHS compliance supports use in lead-free production processes.

Why Choose XC7A75T-L2FGG484E?

The XC7A75T-L2FGG484E positions itself as a balanced FPGA option that combines substantial programmable logic, on-chip memory, and high I/O density within a compact 484-BBGA package. Its extended-grade temperature rating and RoHS compliance make it suitable for production designs that require predictable environmental specifications and regulatory alignment.

This device is appropriate for design teams and procurement seeking a single-chip programmable solution that consolidates logic, memory, and I/O to simplify board-level architecture and reduce component count while maintaining clear electrical and thermal parameters.

Request a quote or submit an inquiry for XC7A75T-L2FGG484E to receive pricing and availability information tailored to your volume and delivery needs.

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