XC7A75T-L2FGG676E

The XC7A75T-L2FGG676E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides 75,520 logic elements and approximately 3.87 Mbits of embedded memory in a compact 676‑BGA package.

With 300 user I/Os, a core voltage range of 950 mV to 1.05 V, and an extended grade operating range of 0 °C to 100 °C, this device is designed for designs that require significant on‑chip logic, memory and I/O capability in a surface‑mount format.

Key Features

• Logic Capacity  75,520 logic elements provide substantial programmable logic resources for implementing custom digital functions.
• Embedded Memory  Approximately 3.87 Mbits of on‑chip RAM support data buffering, state machines, and embedded storage.
• I/O Count  300 user I/Os enable broad interfacing to external devices and subsystems.
• Power and Core Voltage  Core supply range of 950 mV to 1.05 V supports the device’s operating requirements.
• Package and Mounting  676‑BGA (supplier device package 676‑FBGA, 27×27) in a surface‑mount form factor minimizes board area while providing high pin density.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments within that thermal window.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic Development  Implement complex, application‑specific logic using 75,520 logic elements and embedded RAM for state and buffering.
• I/O‑Intensive Interfaces  Use the 300 user I/Os to connect multiple external peripherals or parallel interfaces in a single FPGA solution.
• Compact Board Designs  Leverage the 676‑FBGA (27×27) package and surface‑mount mounting to fit high‑density programmable logic into space‑constrained PCBs.

Unique Advantages

• High Logic Density: 75,520 logic elements enable sizable designs without external programmable logic.
• Substantial On‑Chip Memory: Approximately 3.87 Mbits of embedded RAM reduce dependency on external memory for buffering and local storage.
• Robust I/O Complement: 300 user I/Os provide flexibility for multiple parallel and serial connections.
• Compact, High‑Pin Package: 676‑FBGA (27×27) offers a high pin count in a compact footprint for dense system integration.
• Extended Grade Operation: Rated for 0 °C to 100 °C operation to meet the thermal requirements of many embedded applications.
• Low‑Voltage Core: Core supply between 950 mV and 1.05 V supports modern power regimes for programmable logic.

Why Choose XC7A75T-L2FGG676E?

The XC7A75T-L2FGG676E positions itself as a balanced FPGA solution offering significant logic and memory resources alongside a large I/O count in a compact, surface‑mount 676‑BGA package. Its extended grade temperature range and RoHS compliance make it suitable for a range of embedded designs that require on‑chip integration of logic, storage and I/O.

This device is well suited for engineers and teams seeking a scalable, high‑capacity programmable logic component that integrates substantial on‑chip RAM and I/O capability while maintaining a compact board footprint.

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