XC7K160T-1FB484I

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA

Quantity 479 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-1FB484I – Kintex®-7 FPGA, 484-FCBGA

The XC7K160T-1FB484I is a Kintex®-7 field programmable gate array (FPGA) manufactured by AMD. It provides a programmable logic platform characterized by 162,240 logic elements and approximately 12 Mbits of embedded memory, intended for designs that require substantial on-chip logic and memory resources.

Supplied in a 484-FCBGA (23×23) surface-mount package, the device supports 285 I/O and operates over an industrial temperature range of −40 °C to 100 °C with a core voltage supply range of 970 mV to 1.03 V.

Key Features

  • Core Logic  162,240 logic elements provide the primary programmable fabric for implementing complex digital functions and custom logic.
  • Embedded Memory  Approximately 12 Mbits of on-chip RAM to support buffering, caching, and data-path storage without external memory.
  • I/O Capacity  285 general-purpose I/O pins enable extensive connectivity to peripherals and external devices from a single package.
  • Power  Core supply requirement specified from 970 mV to 1.03 V, enabling precise power budgeting and system-level power design.
  • Package & Mounting  484-ball FCBGA package (23×23) in a surface-mount form factor for high-density board integration.
  • Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS‑compliant material composition for environmental and regulatory conformance.

Unique Advantages

  • High logic capacity: 162,240 logic elements deliver significant programmable resource density for implementing large FPGA designs on a single device.
  • Substantial on-chip memory: Approximately 12 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path tasks.
  • Robust I/O integration: 285 I/O pins allow broad interfacing options, simplifying system-level routing and peripheral connectivity.
  • Industrial temperature support: Rated from −40 °C to 100 °C to accommodate a wide range of environmental conditions.
  • Compact FCBGA package: 484-ball 23×23 FCBGA enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
  • Clear power specification: Defined core voltage range (970 mV–1.03 V) aids in power-supply design and integration.

Why Choose XC7K160T-1FB484I?

The XC7K160T-1FB484I positions itself as a balance of logic density, embedded memory, and I/O capacity in a compact FCBGA package. Its combination of 162,240 logic elements, approximately 12 Mbits of on-chip RAM, and 285 I/O make it suited to designs that require substantial programmable resources while maintaining a controlled power envelope and industrial temperature resilience.

Backed by RoHS compliance and supplied by AMD, this FPGA is appropriate for engineers and procurement teams seeking a scalable, high-resource programmable device for demanding embedded and electronic system applications.

Request a quote or submit an inquiry today to get pricing and availability information for the XC7K160T-1FB484I.

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