XC7K160T-1FBG676C

The XC7K160T-1FBG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density programmable logic platform with a substantial on-chip memory complement and a large I/O count in a compact surface-mount FCBGA package.

Key device characteristics include 162,240 logic elements, approximately 11.98 Mbits of embedded memory, 400 user I/O pins, a 676-FCBGA (27×27) package, core voltage range of 970 mV to 1.03 V, and commercial-grade operation from 0 °C to 85 °C.

Key Features

• Core / Logic Capacity  162,240 logic elements for implementing complex custom digital logic and parallel processing architectures.
• Embedded Memory  Approximately 11.98 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many designs.
• I/O  400 user I/O pins to support wide bus interfaces, high channel counts, and extensive peripheral connectivity.
• Power / Voltage  Core supply range of 970 mV to 1.03 V, enabling predictable power planning for system design.
• Package & Mounting  676-FCBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C and RoHS compliant for environmental regulatory requirements.

Typical Applications

• Custom digital logic  Implement complex, application-specific digital functions using the device's 162,240 logic elements.
• High-density I/O systems  Leverage 400 user I/O pins for multi-channel interfaces, wide parallel buses, and extensive peripheral connections.
• Embedded memory–heavy designs  Use approximately 11.98 Mbits of on-chip RAM for local buffering, packet processing, and temporary data storage to reduce external memory dependence.

Unique Advantages

• High logic capacity: 162,240 logic elements enable implementation of sizeable, partitioned designs on a single device.
• Significant on-chip memory: Approximately 11.98 Mbits of embedded RAM simplifies data handling and lowers external memory requirements.
• Large I/O count: 400 I/O pins provide design flexibility for diverse interface and peripheral needs.
• Compact FCBGA packaging: The 676-FCBGA (27×27) surface-mount package delivers high integration in a space-efficient footprint.
• Predictable power window: A defined core voltage range (970 mV to 1.03 V) aids power supply selection and thermal planning.
• Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance to meet common industry requirements.

Why Choose XC7K160T-1FBG676C?

The XC7K160T-1FBG676C positions itself as a high-density Kintex®-7 FPGA option for designs that require a large logic fabric, substantial embedded memory, and extensive I/O in a compact FCBGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of board-level digital applications.

Manufactured by AMD, this device offers designers a scalable FPGA resource for integrating complex digital functions and local memory capacity while maintaining a compact package footprint and adherence to RoHS requirements.

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