XC7K160T-1FFG676C

The XC7K160T-1FFG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It delivers high logic capacity and substantial on-chip memory in a compact 676-FCBGA (27×27) package for surface-mount applications.

Engineered for designs that require approximately 162,240 logic elements, roughly 11.98 Mbits of embedded memory and 400 I/O connections, this commercial-grade FPGA supports a wide range of complex digital implementations within a 0 °C to 85 °C operating window.

Key Features

• Core Logic: Approximately 162,240 logic elements provide significant programmable logic capacity for implementing complex digital functions and custom system logic.
• Embedded Memory: Approximately 11.98 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory dependencies.
• I/O Resources: 400 user I/O pins offer broad connectivity options for interfacing with peripherals, sensors, and external subsystems.
• Power Supply Range: Core voltage specified from 970 mV to 1.03 V to match system power rails and design constraints.
• Package & Mounting: 676-FCBGA (27×27) package in a surface-mount format provides a compact footprint for space-constrained PCBs.
• Operating Condition & Grade: Commercial grade operation across 0 °C to 85 °C for mainstream embedded and electronic applications.
• Environmental Compliance: RoHS compliant for adherence to common environmental and manufacturing requirements.

Typical Applications

• Custom System Logic: Implement control engines, protocol bridges, and glue logic leveraging the large logic element count and abundant I/O.
• Data Buffering and Processing: Use the on-chip RAM for buffering and intermediate data storage in streaming or packet-based designs.
• Interface Aggregation: Consolidate multiple peripheral interfaces into a single programmable device using the 400 I/O pins for flexible connectivity.

Unique Advantages

• High Logic Density: Large logic element count enables integration of complex functions that reduce external components and board-level integration effort.
• Substantial Embedded Memory: Nearly 12 Mbits of on-chip RAM helps minimize reliance on external memory, simplifying BOM and layout.
• Wide I/O Count: 400 I/O pins provide the flexibility to connect numerous peripherals and high-pin-count interfaces without additional multiplexing hardware.
• Compact FCBGA Package: 676-FCBGA (27×27) offers a space-efficient footprint for high-density board designs while enabling surface-mount assembly.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet requirements for mainstream embedded and electronic systems.
• Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and global market requirements.

Why Choose XC7K160T-1FFG676C?

The XC7K160T-1FFG676C is positioned for engineers and procurement teams seeking a commercial-grade Kintex®-7 FPGA that combines high logic capacity, significant embedded memory, and extensive I/O in a compact 676-FCBGA surface-mount package. Its voltage range and operating temperature align with common system designs that demand reliable digital integration.

This part is well suited to development efforts that prioritize integration density and flexible I/O without increasing board complexity. Specified features such as core voltage range, operating temperature, and RoHS compliance provide clear, verifiable attributes for design selection and lifecycle planning.

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