XC7K160T-1FFG676I

The XC7K160T-1FFG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD. This device provides a high-density programmable logic fabric with 162,240 logic elements and approximately 11.98 Mbits of embedded memory, suitable for designs that require substantial on-chip resources.

Key physical and operational characteristics include a 676-ball FCBGA package (27 × 27 mm), surface-mount mounting, a supply voltage range of 970 mV to 1.03 V, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic Density  162,240 logic elements to implement complex digital functions and custom hardware acceleration in a single device.
• Embedded Memory  Approximately 11.98 Mbits of on-chip RAM for data buffering, FIFOs, and state storage without external memory.
• I/O Capacity  400 I/O pins to support broad connectivity and interfacing requirements on modern PCBs.
• Power Supply  Operates from a core supply in the range of 970 mV to 1.03 V, enabling predictable power planning for system design.
• Package & Mounting  676-FCBGA (27 × 27 mm) package in a 676-BBGA footprint with surface-mount mounting suitable for standard PCB assembly flows.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in temperature-sensitive applications.
• Regulatory Compliance  RoHS compliant.

Unique Advantages

• High on-chip integration: Combining 162,240 logic elements with approximately 11.98 Mbits of embedded memory reduces dependence on external components and simplifies board-level design.
• Broad I/O support: 400 I/O pins provide flexibility for interfacing to a wide range of peripherals and high-pin-count connectors.
• Industrial-grade operation: Specified for −40 °C to 100 °C to support deployments across demanding thermal environments.
• Compact, standardized package: 676-FCBGA (27 × 27 mm) offers a compact footprint while providing a high pin-count for system integration.
• Predictable power envelope: A defined core supply range of 970 mV to 1.03 V enables accurate power budgeting in multi-rail systems.

Why Choose XC7K160T-1FFG676I?

The XC7K160T-1FFG676I is positioned for designs that require substantial programmable logic and embedded memory in an industrial-grade FPGA. With 162,240 logic elements, approximately 11.98 Mbits of on-chip RAM, and 400 I/Os in a 676-FCBGA package, it delivers a balance of density and connectivity while fitting standard surface-mount assembly processes.

Engineers and procurement teams seeking a reliable, high-density Kintex®-7 device from AMD will find this part appropriate where on-chip resources, package density, and industrial temperature operation are primary selection criteria.

Request a quote or submit a purchase inquiry to check availability and pricing for the XC7K160T-1FFG676I.