XC7K160T-2FBG484C

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA

Quantity 377 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-2FBG484C – Kintex®-7 Field Programmable Gate Array

The XC7K160T-2FBG484C is a Kintex®-7 field programmable gate array (FPGA) in a 484‑ball FCBGA package. It combines large on‑chip logic and memory resources with a high I/O count and a compact surface‑mount FCBGA footprint for programmable digital designs.

This commercial‑grade device is suitable for designs that require substantial programmable logic, embedded memory, and numerous I/O signals while operating within a standard commercial temperature range and a defined supply voltage window.

Key Features

  • Configurable Logic Contains 162,240 logic elements to implement complex digital logic and custom processing functions.
  • Embedded Memory Provides approximately 12 Mbits of on‑chip RAM for buffering, data handling, and implemented state machines.
  • I/O Capacity 285 user I/O pins support extensive external interfacing and parallel signal routing.
  • Package 484‑FBGA (484‑FCBGA) 23×23 mm supplier package for high‑density surface mounting.
  • Power Core voltage supply range of 0.970 V to 1.03 V to match board power rails and regulator designs.
  • Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Mounting and Compliance Surface mount device, RoHS compliant for environmentally regulated assemblies.

Typical Applications

  • Custom digital logic — Implement complex, application‑specific logic and control functions using the device's large logic element count.
  • On‑chip data buffering — Use the approximately 12 Mbits of embedded memory for data buffering, FIFOs, and local storage to reduce external memory needs.
  • I/O‑dense interfaces — Leverage 285 I/O pins to connect multiple peripherals, sensors, or parallel data buses directly to the FPGA.
  • Prototyping and development — Deploy in board prototypes that require a compact FCBGA package and surface‑mount assembly.

Unique Advantages

  • High logic capacity: 162,240 logic elements enable implementation of large-scale custom logic without immediate external acceleration.
  • Significant embedded memory: Approximately 12 Mbits of on‑chip RAM reduce dependency on external memory for many buffering and state‑storage needs.
  • Extensive I/O: 285 user I/O pins support complex connectivity and parallel interfaces directly from the FPGA.
  • Compact, surface‑mount package: 484‑ball FCBGA (23×23 mm) offers a high‑density solution for space‑constrained PCB layouts.
  • Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and development platforms.
  • RoHS compliant: Meets environmental compliance requirements for lead‑free assembly.

Why Choose XC7K160T-2FBG484C?

The XC7K160T-2FBG484C positions itself as a programmable logic device that balances large logic resources, substantial embedded memory, and a high number of I/Os in a compact FCBGA package. Its defined core voltage window and commercial temperature rating make it appropriate for board‑level designs that require predictable electrical and thermal characteristics.

This device is well suited for engineering teams designing custom digital systems that need on‑chip memory and significant I/O capacity while maintaining a surface‑mount form factor and RoHS compliance. It delivers a scalable, integrated building block for medium‑to‑large FPGA designs where logic density and embedded RAM are primary considerations.

Request a quote or submit a purchasing inquiry to obtain pricing, lead time, and availability for the XC7K160T-2FBG484C.

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