XC7K160T-2FBG676I

The XC7K160T-2FBG676I is a Kintex®-7 field programmable gate array (FPGA) IC from AMD. It provides a high-density programmable fabric with 162,240 logic elements and approximately 12 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and memory resources. With 400 user I/Os, an industrial operating temperature range, and a compact 676-FCBGA (27×27) package, this device is positioned for demanding embedded and industrial applications where integration and configurability are required.

Key Features

• Core Logic Capacity  162,240 logic elements (cells) delivering significant on-chip programmable logic resources for complex designs.
• Embedded Memory  Approximately 12 Mbits of total on-chip RAM (11,980,800 bits) to support buffering, state retention, and local data storage.
• I/O Count  400 user I/Os to enable broad interfacing with peripherals, sensors, and external devices.
• Power Supply  Core voltage supply range from 970 mV to 1.03 V, allowing integration into systems with precise power rails.
• Package & Mounting  676-BBGA, FCBGA package in a 676-FCBGA (27×27) footprint; surface-mount mounting type suitable for compact PCB implementations.
• Temperature Range & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant ensuring adherence to common environmental and material standards.

Unique Advantages

• High integration density: 162,240 logic elements provide the capacity to implement large, complex logic functions on a single device.
• Substantial on‑chip memory: Approximately 12 Mbits of embedded RAM supports on-chip buffering and stateful operations without immediate reliance on external memory.
• Broad I/O flexibility: 400 user I/Os enable extensive external connectivity options for diverse system interfaces.
• Industrial temperature rating: Rated from −40 °C to 100 °C to meet the needs of temperature-sensitive or outdoor deployments.
• Compact, production-ready package: 676-FCBGA (27×27) surface-mount package supports high-density PCB layouts and reliable board-level assembly.
• Regulatory consideration: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7K160T-2FBG676I?

The XC7K160T-2FBG676I combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 676-FCBGA package, offering a balanced solution for engineers designing complex embedded and industrial systems. Its industrial temperature rating and RoHS compliance make it suitable for environments where robustness and regulatory compliance matter.

This device is a practical choice for development teams and integrators who need scalable programmable logic, significant on-chip memory, and flexible interfacing in a production-ready surface-mount package.

Request a quote or submit a sales inquiry for the XC7K160T-2FBG676I to receive pricing and availability information tailored to your project needs.