XC7K160T-2FBG676C

The XC7K160T-2FBG676C is an AMD Kintex®-7 field programmable gate array in a 676-FCBGA package designed for commercial electronic designs. It provides 162,240 logic elements, approximately 12 Mbits of embedded memory, and 400 I/O pins, delivering a high-capacity, configurable logic fabric for board-level integration within a surface-mount 27 × 27 mm footprint.

Key attributes include a supply range of 970 mV to 1.03 V, a commercial operating temperature range of 0°C to 85°C, and RoHS compliance—making it suitable for commercial-grade applications that require dense logic, substantial on-chip memory, and abundant I/O in a compact package.

Key Features

• Core Capacity  162,240 logic elements provide a high-density programmable fabric for complex logic implementations.
• Embedded Memory  Approximately 12 Mbits of on-chip RAM to support data buffering, state storage, and on-chip buffering requirements.
• I/O  400 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power  Voltage supply range of 970 mV to 1.03 V, enabling predictable core operating conditions.
• Package & Mounting  676-FCBGA (27 × 27 mm) in a surface-mount package for compact board integration and high pin density.
• Operating Range & Compliance  Commercial temperature rating of 0°C to 85°C and RoHS compliant for standard commercial deployments.

Typical Applications

• Commercial Embedded Systems  Use the device where high logic capacity and embedded memory are required in a commercial-grade product.
• High-Density I/O Designs  Systems that require many parallel interfaces can leverage the 400 I/O pins for flexible connectivity.
• Memory-Intensive Logic  Designs needing on-chip RAM for buffering, lookup tables, or state machines can take advantage of approximately 12 Mbits of embedded memory.
• Board-Level Integration  Compact 676-FCBGA surface-mount packaging supports dense PCB layouts and space-constrained assemblies.

Unique Advantages

• High Logic Density: 162,240 logic elements enable complex, compute-dense designs without external programmable logic.
• Substantial On-Chip Memory: Approximately 12 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Generous I/O Count: 400 I/O pins offer flexibility for interfacing multiple peripherals and parallel buses.
• Compact, High-Pin Package: 676-FCBGA (27 × 27 mm) surface-mount package supports high pin-count routing in a small board area.
• Commercial Temperature and RoHS Compliance: Rated 0°C to 85°C and RoHS compliant for standard commercial deployments and regulatory adherence.
• Controlled Core Voltage Range: 970 mV to 1.03 V supply range provides defined operating conditions for system power design.

Why Choose XC7K160T-2FBG676C?

The XC7K160T-2FBG676C positions itself as a high-capacity, commercial-grade FPGA that combines significant logic resources, ample embedded memory, and a broad I/O complement in a compact FCBGA package. It is well suited for designers who need a configurable, board-level solution for complex logic functions while maintaining a small footprint and clear power and temperature boundaries.

For teams focused on scalable designs and reliable commercial deployment, this Kintex®-7 device offers predictable electrical and thermal parameters, substantial on-chip resources, and the package density required for modern embedded systems.

Request a quote or submit an inquiry to get pricing and availability for the XC7K160T-2FBG676C for your next commercial FPGA design.