XC7K160T-2FF676C

IC FPGA 400 I/O 676FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 11980800 162240 676-BBGA, FCBGA

Quantity 1,292 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-2FF676C – Kintex®-7 FPGA, 676-FCBGA (27×27)

The XC7K160T-2FF676C is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, offered as a commercial-grade surface-mount device. It provides high logic capacity, substantial on-chip memory, and a large number of I/O pins in a 676-ball FCBGA package.

Key device characteristics include 162,240 logic elements, approximately 12 Mbits of embedded memory, 400 I/O pins, a core supply range of 970 mV to 1.03 V, and an operating temperature range of 0 °C to 85 °C—making it suitable for a wide range of commercial electronic designs.

Key Features

  • Core Architecture Kintex®-7 FPGA family device from AMD, designed as a high-capacity programmable logic platform.
  • Logic Capacity Contains 162,240 logic elements to implement complex digital logic, state machines, and custom datapaths.
  • Embedded Memory Total on-chip RAM of 11,980,800 bits—approximately 12 Mbits—suitable for buffering, FIFOs, and local storage.
  • I/O Count 400 programmable I/O pins to support extensive interfacing and parallel connectivity requirements.
  • Power and Voltage Core voltage supply requirement from 970 mV to 1.03 V, enabling precise power delivery for the FPGA core.
  • Package and Mounting 676-BBGA / 676-FCBGA package (27×27 mm) with surface-mount mounting type for dense board layouts and compact system designs.
  • Operating Range and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 162,240 logic elements provide capacity for large-scale combinational and sequential logic implementations.
  • Significant on-chip memory: Approximately 12 Mbits of embedded RAM reduce the need for external memory in many buffering and local-storage scenarios.
  • Extensive I/O availability: 400 I/O pins enable multiple parallel interfaces and flexible board-level integration.
  • Compact FCBGA package: 676-ball FCBGA (27×27 mm) balances I/O count and PCB area for space-constrained designs.
  • Controlled core voltage range: 970 mV to 1.03 V allows tight power delivery planning and predictable core operation.
  • Commercial-grade suitability: Specified operating range of 0 °C to 85 °C for mainstream commercial electronics applications.

Why Choose XC7K160T-2FF676C?

The XC7K160T-2FF676C delivers a combination of high logic capacity, meaningful on-chip memory, and extensive I/O in a compact 676-FCBGA package. As a commercial-grade Kintex®-7 FPGA from AMD, it is positioned for designs that require programmable hardware density and flexible interfacing while adhering to standard commercial operating conditions.

This part is well suited for teams designing complex digital systems that benefit from integrated RAM and a large number of I/Os, offering scalability and packaging choices that support compact PCB layouts and robust board-level integration.

Request a quote or submit an inquiry for availability and pricing for the XC7K160T-2FF676C to begin evaluating it for your next commercial FPGA design.

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