XC7K160T-2FBG484I

The XC7K160T-2FBG484I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC provided in a 484-ball FCBGA package. It delivers high logic density and on-chip memory capacity suitable for industrial-grade designs that require substantial programmable logic, embedded memory, and a sizeable I/O complement.

Key device attributes include 162,240 logic elements, approximately 11.98 Mbits of embedded memory, 285 user I/Os, a 484-FCBGA (23×23) surface-mount package, and an industrial operating temperature range of -40 °C to 100 °C.

Key Features

• Logic Capacity  162,240 logic elements to implement complex programmable logic and control functions.
• Embedded Memory  Approximately 11.98 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources  285 available I/Os to support a wide range of external interfaces and board-level connections.
• Package & Mounting  484-FCBGA (23×23) / 484-BBGA package in a surface-mount form factor for high-density PCB integration.
• Power Supply  Core operating voltage range of 970 mV to 1.03 V to match system power designs requiring precise core voltages.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, supporting deployment in industrial environments.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory conformity.

Unique Advantages

• High logic density: 162,240 logic elements enable implementation of large-scale logic, control, and data-path functions on a single device, reducing system component count.
• Significant on-chip memory: Approximately 11.98 Mbits of embedded RAM provides local storage for buffering and state machines, helping to minimize external memory needs.
• Generous I/O availability: 285 I/Os allow flexible interfacing with peripherals, sensors, and high-pin-count connectors without extensive external multiplexing.
• Industry-grade thermal range: Operation from -40 °C to 100 °C supports reliable performance in temperature-variable industrial settings.
• Compact surface-mount package: The 484-FCBGA (23×23) package delivers high integration density for space-constrained PCBs while maintaining robust soldered mounting.
• Regulatory readiness: RoHS compliance simplifies assembly and environmental compliance for manufactured products.

Why Choose XC7K160T-2FBG484I?

The XC7K160T-2FBG484I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand substantial programmable logic, embedded memory, and a wide I/O set within a compact surface-mount package. Its combination of 162,240 logic elements and approximately 11.98 Mbits of on-chip RAM supports complex control, processing, and buffering tasks while helping to reduce external component count.

This device is appropriate for teams and products that require scalable programmable resources, reliable operation across a broad temperature range, and a compact 484-FCBGA footprint for board-level integration. Its RoHS compliance and defined voltage and thermal ranges make it straightforward to evaluate for industrial deployments and system-level qualification.

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