XC7K160T-2FB676I

The XC7K160T-2FB676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering a large logic fabric, substantial on-chip memory, and a dense I/O count in a 676-ball FCBGA package. Built for industrial-grade applications, it provides programmable logic capacity and system I/O for complex digital designs.

Key attributes include 162,240 logic elements, approximately 11.98 Mbits of embedded RAM, 400 programmable I/Os, and specified operation across a wide industrial temperature range, enabling integration into designs that require configurable logic and robust environmental tolerance.

Key Features

• Core Logic Capacity  162,240 logic elements provide substantial programmable logic resources for implementing complex digital functions and custom datapaths.
• Configurable Logic Blocks (CLBs)  12,675 CLBs offer the building blocks for creating registered logic, state machines, and custom processing pipelines.
• Embedded Memory  Approximately 11.98 Mbits of on-chip RAM for buffering, FIFOs, and lookup tables to support data-centric designs.
• I/O Density  400 I/Os enable broad external interfacing for sensors, peripherals, and high-pin-count system connections.
• Power Supply  Specified core voltage range of 0.970 V to 1.03 V to match system power-rail requirements.
• Package & Mounting  676-BBGA (676-FCBGA, 27 × 27 mm) surface-mount package for compact board integration and high pin density.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Regulatory Compliance  RoHS compliant to support environmental and product compliance requirements.

Typical Applications

• Industrial Control & Automation  Programmable logic and industrial temperature rating make this FPGA suitable for control systems, motion controllers, and programmable automation devices.
• Data Acquisition & Signal Processing  Large logic capacity and on-chip RAM support custom data handling, buffering, and real-time signal processing tasks.
• High-Density I/O Systems  With 400 I/Os, the device supports systems requiring extensive peripheral interfacing or multi-channel I/O aggregation.
• Custom Embedded Systems  Use the FPGA’s configurable resources to implement tailored digital functions, protocol bridging, or accelerators within embedded platforms.

Unique Advantages

• Large Logic Resource: 162,240 logic elements provide capacity for complex custom logic and multi-function designs, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 11.98 Mbits of embedded RAM enables local buffering and data-store architectures without immediate external memory dependence.
• High I/O Count: 400 I/Os simplify system integration by supporting many external signals and peripherals directly on the FPGA.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact, High-Density Package: The 676-FCBGA (27 × 27 mm) surface-mount package delivers high pin count in a space-efficient footprint for PCB-constrained designs.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing and disposal.

Why Choose XC7K160T-2FB676I?

The XC7K160T-2FB676I combines a large logic fabric, significant embedded memory, and a high I/O count in an industrial-grade FPGA package. Its electrical and thermal specifications make it suitable for engineered systems that require configurable digital logic, substantial on-chip resources, and reliable operation across a broad temperature range.

This FPGA is well suited to design teams building industrial control, data acquisition, or custom embedded systems that benefit from on-device programmability, compact packaging, and environmental tolerance. The device’s resource set and package choices support scalable, robust implementations in applications where integration and configurability are priorities.

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