XC7K160T-2FF676I

The XC7K160T-2FF676I is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for high-density, reconfigurable logic implementations. It provides 162,240 logic elements, approximately 11.98 Mbits of embedded memory, and 400 user I/Os in a 676-FCBGA (27×27) surface-mount package.

Engineered for industrial applications, the device operates across a core voltage range of 0.970 V to 1.03 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that demand substantial on-chip logic, memory, and I/O capability in a compact package.

Key Features

• Core Logic  162,240 logic elements provide a large fabric for implementing complex programmable logic, custom accelerators, and control functions.
• Embedded Memory  Approximately 11.98 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing without external memory dependencies.
• I/O Capacity  400 user I/Os enable broad interfacing options for sensors, transceivers, peripherals, and board-level connectivity.
• Power Supply  Core voltage supply range from 0.970 V to 1.03 V supports precise power budgeting and integration into controlled-power systems.
• Package & Mounting  676-BBGA / 676-FCBGA (27×27) package in a surface-mount form factor for high-density board designs.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.

Typical Applications

• Custom Hardware Acceleration  Use the 162,240 logic elements and on-chip memory to offload compute-intensive functions and implement application-specific accelerators.
• High‑Density I/O Aggregation  With 400 user I/Os, consolidate multiple interfaces and protocols on a single device for compact I/O-heavy systems.
• Embedded Data Processing  Approximately 11.98 Mbits of embedded RAM supports local buffering and real-time data handling inside the FPGA fabric.
• Industrial Control & Automation  Industrial temperature rating and robust packaging make the device suitable for industrial control, monitoring, and automation platforms.

Unique Advantages

• High Logic Density: 162,240 logic elements enable large-scale programmable implementations without immediate migration to multiple devices.
• Significant On‑Chip RAM: Nearly 12 Mbits of embedded memory reduces reliance on external memory and simplifies board-level designs.
• Extensive I/O Count: 400 user I/Os allow flexible system partitioning and direct interfacing to numerous peripherals and subsystems.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in thermally challenging environments.
• Compact FCBGA Package: 676-FCBGA (27×27) provides a balance of I/O density and board-space efficiency for high-performance designs.
• Tightly Controlled Core Voltage: 0.970 V to 1.03 V supply window supports predictable power design and voltage-domain management.

Why Choose XC7K160T-2FF676I?

The XC7K160T-2FF676I positions itself as a high-density, industrial-grade FPGA suited for engineers who need substantial programmable logic, abundant on-chip memory, and a large number of I/Os in a compact surface-mount FCBGA package. Its combination of logic capacity, embedded RAM, and industrial temperature rating delivers a reliable foundation for demanding embedded systems and custom hardware designs.

Choose this part when you require a scalable, integrable FPGA platform that supports complex logic implementations, on-chip data storage, and broad interfacing—all backed by the Kintex®-7 family architecture and industrial-grade operating specifications.

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