XC7K160T-3FBG676E

The XC7K160T-3FBG676E is a Kintex®-7 field programmable gate array (FPGA) in a 676-FCBGA package designed for designs that require substantial programmable logic, on-chip memory, and flexible I/O. Its combination of 162,240 logic elements, approximately 12 Mbits of embedded memory, and 400 user I/Os targets applications that demand high integration and significant on-chip resources.

Offered in a surface-mount 676-FCBGA (27×27) package with an extended grade and a defined operating range, this device is suited to engineering and procurement teams seeking a high-capacity FPGA from AMD with RoHS compliance.

Key Features

• Logic Capacity 162,240 logic elements (cells) to implement complex custom logic and large-scale programmable functions.
• Embedded Memory Approximately 12 Mbits of on-chip RAM available for buffering, lookup tables, and state storage.
• I/O Resources 400 user I/Os to support dense interfacing with external peripherals, buses, and daughter cards.
• Core Voltage Specified supply range from 970 mV to 1.03 V for the device core power rail.
• Package & Mounting 676-FCBGA (27×27) package in a surface-mount form factor for compact board integration.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for a wide range of commercial and industrial-adjacent environments.
• Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Custom logic and prototyping Implement and iterate complex FPGA designs using the device’s large logic capacity and embedded memory.
• Memory-intensive designs Use the approximately 12 Mbits of on-chip RAM for buffering, packet processing, or intermediate data storage within the FPGA fabric.
• High-density I/O integration Leverage 400 I/Os for connectivity to multi-channel sensors, peripherals, or expansion modules.
• Board-level integration Surface-mount 676-FCBGA package allows dense PCB layouts where board space and integration matter.

Unique Advantages

• Large programmable fabric: 162,240 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing component count.
• Substantial on-chip memory: Approximately 12 Mbits of embedded RAM minimizes the need for external memory in many buffer and storage use cases.
• Extensive I/O availability: 400 user I/Os enable versatile interfacing options without additional GPIO expanders.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package supports compact system designs and standard PCB assembly processes.
• Defined power envelope: Core supply range (970 mV–1.03 V) provides clear design parameters for power delivery and sequencing.
• Regulatory readiness: RoHS compliance supports lead-free production requirements.

Why Choose XC7K160T-3FBG676E?

The XC7K160T-3FBG676E balances a high logic element count with substantial embedded memory and broad I/O resources, making it a practical choice for engineers consolidating complex functions into a single programmable device. Its FCBGA package and surface-mount mounting suit compact, production-ready board designs, while the extended grade and specified operating range provide predictable environmental limits for system planning.

This AMD Kintex®-7 FPGA is appropriate for teams building memory- and I/O-intensive designs that require significant on-chip logic, and for projects that benefit from the integration and consolidation advantages of a large-capacity FPGA with RoHS compliance.

Request a quote or contact sales to discuss availability, pricing, and lead times for the XC7K160T-3FBG676E.