XC7K160T-L2FBG676E

The XC7K160T-L2FBG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) offered in a 676-ball FCBGA package. It provides a large logic capacity and on-chip memory in a surface-mount package suited for designs that require extensive programmable logic, embedded RAM, and a substantial number of I/O connections.

Targeted at applications requiring high integration and flexibility, this device combines 162,240 logic elements with approximately 11.98 Mbits of embedded memory and up to 400 I/Os, while operating from a core voltage range of 870 mV to 930 mV and within a 0 °C to 100 °C operating window.

Key Features

• Core Logic Capacity 
  162,240 logic elements provide dense programmable logic resources for complex digital designs.
• Embedded Memory 
  Approximately 11.98 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage within the FPGA fabric.
• I/O Density 
  Up to 400 I/Os to interface with peripherals, memory devices, and external logic domains.
• Package and Mounting 
  676-FCBGA (27×27) package (676-BBGA, FCBGA) in a surface-mount form factor for compact board integration.
• Power 
  Core voltage supply range of 870 mV to 930 mV to match system power-rail planning.
• Thermal and Grade 
  Extended grade with an operating temperature range of 0 °C to 100 °C to suit a range of commercial and extended-temperature designs.
• Compliance 
  RoHS compliant for environmental and materials consideration.

Typical Applications

• System Prototyping and Development 
  Use the large logic element count and embedded RAM to prototype and validate complex digital architectures before production.
• Custom Signal Processing 
  Leverage the combination of logic resources and on-chip memory for implementing custom processing pipelines and buffering.
• Interface Aggregation 
  Deploy the 400 I/Os to consolidate multiple peripheral interfaces and bridge disparate bus standards within a single programmable device.
• Embedded Control and Glue Logic 
  Implement high-density control logic and protocol handling while minimizing external discrete components.

Unique Advantages

• High logic density: 162,240 logic elements enable integration of complex functions and feature consolidation on a single device.
• Substantial on-chip memory: Approximately 11.98 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 400 I/Os provide flexibility to connect multiple interfaces, sensors, and peripherals without extensive glue logic.
• Compact FCBGA package: 676-FCBGA (27×27) surface-mount package supports dense PCB layouts and high pin counts in a compact footprint.
• Defined power envelope: Core supply range of 870 mV to 930 mV allows predictable power-supply design and sequencing considerations.
• RoHS compliant and extended grade: Environmentally compliant material status and extended-grade temperature rating support broader deployment scenarios.

Why Choose XC7K160T-L2FBG676E?

The XC7K160T-L2FBG676E positions itself as a high-capacity, flexible FPGA option with significant on-chip memory and a wide I/O footprint, all in a 676-ball FCBGA surface-mount package. Its combination of 162,240 logic elements, approximately 11.98 Mbits of embedded RAM, and up to 400 I/Os makes it suitable for designs that require consolidation of complex logic, local buffering, and extensive peripheral connectivity while operating within a defined core voltage and 0 °C to 100 °C range.

This device is well suited to engineering teams and procurement focused on scalable, high-density programmable solutions where integration and predictable electrical/thermal characteristics are critical. Its extended-grade rating and RoHS compliance contribute to longer-term design stability and regulatory alignment.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the XC7K160T-L2FBG676E.