XC7K160T-L2FBG676I

The XC7K160T-L2FBG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD designed for applications requiring high logic density, significant on-chip memory, and flexible I/O. With a large logic cell count and substantial embedded RAM, it targets designs that need programmable hardware performance in a compact, surface-mount 676-FCBGA package.

Key Features

• Core Logic — 162,240 logic cells provide substantial programmable logic capacity for complex digital designs.
• On-chip Memory — Approximately 12 Mbits of embedded memory (11,980,800 bits) for buffering, state storage, and on-chip data processing.
• I/O Capability — Up to 400 I/O pins to support multiple interfaces and external peripherals.
• Power — Core voltage supply range of 970 mV to 1.03 V for the device core.
• Package & Mounting — 676-FCBGA (27×27) package in a 676-BBGA form factor, designed for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic implementations — Use the device’s 162,240 logic cells to implement complex finite-state machines, custom datapaths, and gate-level acceleration.
• Memory-intensive processing — Approximately 12 Mbits of embedded RAM supports buffering, lookup tables, and on-chip data handling for streaming and packetized workloads.
• I/O-rich systems — With 400 I/Os, the device is well-suited for designs requiring multiple parallel interfaces or high pin-count connectivity.
• Industrial control and automation — Industrial temperature rating enables deployment in factory-floor controllers, motor control logic, and process monitoring systems.

Unique Advantages

• High logic capacity: 162,240 logic cells provide the headroom to consolidate complex functions into a single FPGA, reducing external components.
• Significant on-chip RAM: Approximately 12 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 400 I/Os simplify integration of multiple interfaces and peripherals without additional bridge devices.
• Industrial-grade thermal range: −40 °C to 100 °C operation supports reliable performance in demanding environments.
• Compact, surface-mount package: 676-FCBGA (27×27) enables high-density PCB layouts while maintaining a robust BGA mounting footprint.
• RoHS compliant: Conforms to RoHS requirements for reduced hazardous substances in assembly.

Why Choose XC7K160T-L2FBG676I?

The XC7K160T-L2FBG676I combines substantial programmable logic, meaningful on-chip memory, and a high I/O count in a compact 676-FCBGA package, making it well-suited for engineers building space-efficient, high-performance FPGA-based systems. Its industrial operating range and RoHS compliance further support deployment in temperature-challenging and environmentally-conscious applications.

This device is appropriate for design teams that require scalable logic capacity, integrated memory resources, and flexible I/O in a surface-mount form factor, delivering long-term value through reduced board-level complexity and consolidated system functionality.

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