XC7K160T-L2FBG484I

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA

Quantity 135 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-L2FBG484I – Kintex®-7 FPGA, 162,240 logic elements, 484-FCBGA

The XC7K160T-L2FBG484I is a Kintex®-7 field programmable gate array (FPGA) in a 484-ball FCBGA package designed for industrial applications. It provides a high count of logic elements, substantial on-chip RAM, and up to 285 I/O to support complex digital designs requiring dense logic and embedded memory resources.

Key Features

  • Core Logic  Contains 162,240 logic elements to implement large-scale digital designs and custom hardware acceleration.
  • Embedded Memory  Approximately 12 Mbits of on-chip RAM (11,980,800 bits) for buffering, FIFOs, and data processing.
  • I/O Capability  Offers 285 user I/O pins to interface with peripherals, sensors, and high-speed I/O channels.
  • Power  Operates from a core supply in the range of 870 mV to 930 mV, enabling defined system power planning and regulation.
  • Package & Mounting  Supplied in a 484-FCBGA (23 × 23) surface-mount package suitable for compact board-level integration.
  • Operating Range  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • High-density digital processing  Leverages 162,240 logic elements and embedded RAM to implement complex signal-processing blocks and custom compute pipelines.
  • Data aggregation and buffering  On-chip memory supports buffering, packet reassembly, and intermediate storage in data-path designs.
  • Industrial control and automation  Industrial temperature rating and robust I/O make it suitable for control logic, motor drives, and factory automation interfaces.

Unique Advantages

  • Large logic capacity: 162,240 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing external components.
  • Substantial on-chip RAM: Approximately 12 Mbits of embedded memory enables local data storage and high-throughput buffering without external SRAM.
  • Versatile I/O count: 285 I/O pins accommodate diverse peripheral connections and multi-channel interfaces on a single device.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding industrial environments.
  • Compact FCBGA package: 484-FCBGA (23×23) surface-mount package allows dense board layouts while providing the connectivity needed for complex systems.
  • Regulatory readiness: RoHS compliance facilitates environmentally conscious manufacturing and integration.

Why Choose XC7K160T-L2FBG484I?

The XC7K160T-L2FBG484I balances a high logic element count, significant embedded memory, and ample I/O in a compact 484-FCBGA package, making it well suited for engineers consolidating multiple functions into a single FPGA. Its industrial operating range and RoHS compliance provide predictable behavior in temperature-critical deployments and support manufacturing requirements.

This device is aimed at designs that require sizeable programmable logic, on-chip RAM for buffering or data processing, and a broad set of I/O—delivering a scalable platform for complex digital systems where integration and reliability matter.

Request a quote or submit an RFQ to get pricing and availability for the XC7K160T-L2FBG484I.

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