XC7K160T-3FFG676E

The XC7K160T-3FFG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed to provide a high-density programmable logic fabric with substantial on-chip memory and flexible I/O. This device combines 162,240 logic elements and approximately 12 Mbits of embedded RAM to support complex digital designs that require significant logic capacity and local memory.

Packaged in a 676-ball FCBGA (27×27) surface-mount package and offered in extended grade, the XC7K160T targets designs that demand dense integration, a broad I/O complement, and controlled-core voltage operation.

Key Features

• Logic Capacity  162,240 logic elements to implement large-scale digital functions and custom logic architectures.
• Embedded Memory  Approximately 12 Mbits of on-chip RAM for buffering, local storage, and data-path acceleration.
• I/O Density  400 user I/O pins to support broad connectivity and multiple parallel interfaces.
• Power and Core Voltage  Core supply range of 0.970 V to 1.03 V to align with platform power requirements.
• Package and Mounting  676-FCBGA (27×27) package in a 676-BBGA footprint; surface-mount mounting type for standard PCB assembly.
• Operating Range  Rated for operation from 0 °C to 100 °C and supplied in Extended grade.
• Regulatory Compliance  RoHS compliant to support environmentally conscious product designs.

Typical Applications

• Custom Digital Processing  Use the device’s large logic and memory resources for complex, application-specific data-paths and algorithm acceleration.
• High-Density I/O Systems  The 400 I/O pins enable integration with multiple parallel interfaces, peripheral controllers, and multi-channel I/O arrangements.
• Embedded System Integration  Leverage on-chip RAM and logic resources to implement custom subsystems, protocol bridging, or real-time control functions.

Unique Advantages

• High Logic Integration: 162,240 logic elements reduce the need for external glue logic and help consolidate multiple functions into a single device.
• Substantial On-Chip Memory: Approximately 12 Mbits of embedded RAM supports buffering and local storage to improve data throughput and reduce external memory dependence.
• Extensive I/O Count: 400 I/Os enable flexible system partitioning and support for parallel interfaces, simplifying board-level design.
• Compact, Surface-Mount Package: The 676-FCBGA (27×27) package delivers high I/O density in a compact form factor suitable for modern PCB layouts.
• Controlled Power Envelope: Specified core voltage range (0.970 V–1.03 V) allows predictable power provisioning and board-level power design.
• Extended Grade and RoHS Compliance: Extended-grade specification and RoHS compliance align with extended-temperature production needs and environmental requirements.

Why Choose XC7K160T-3FFG676E?

The XC7K160T-3FFG676E positions itself as a high-density, memory-rich Kintex®-7 FPGA option for designs that require substantial programmable logic, significant embedded memory, and broad I/O capability. Its combination of 162,240 logic elements, approximately 12 Mbits of on-chip RAM, and 400 I/Os makes it suitable for consolidating complex digital functions onto a single device.

Designed in a 676-FCBGA surface-mount package and offered in Extended grade with RoHS compliance, the XC7K160T-3FFG676E is intended for development teams and procurement looking for a scalable, integrated FPGA building block with clear electrical and environmental specifications.

Request a quote or submit an inquiry to receive pricing and availability for the XC7K160T-3FFG676E.