XC7K160T-2FFG676C

The XC7K160T-2FFG676C is a Kintex®-7 field programmable gate array (FPGA) designed for high-density programmable logic implementations. It combines a large logic fabric with significant embedded RAM and a 400-pin I/O count in a 676‑ball FCBGA package for surface-mount applications.

Engineered for commercial-grade applications, this device offers a balance of on-chip memory, logic capacity, and I/O connectivity while operating within a 0 °C to 85 °C temperature range and a core supply range of 970 mV to 1.03 V.

Key Features

• Logic Capacity  12,675 CLBs delivering 162,240 logic elements to implement complex digital designs and custom processing pipelines.
• Embedded Memory  Approximately 11.98 Mbits of embedded memory (11,980,800 total RAM bits) for data buffering, LUT-based storage and on-chip caching.
• I/O Resources  400 I/O pins to support multiple external interfaces and board-level signal routing.
• Package  676‑BBGA FCBGA package (supplier device package: 676‑FCBGA (27×27)) providing a compact, high-ball-count footprint for dense PCB implementations.
• Power Supply  Core voltage supply range of 970 mV to 1.03 V to match system power requirements and enable controlled power integration.
• Thermal and Mounting  Commercial operating temperature range of 0 °C to 85 °C and surface-mount package suitable for standard PCB assembly processes.
• Compliance  RoHS‑compliant manufacturing and materials.

Typical Applications

• Programmable digital logic  Implements custom logic functions and state machines where a high number of logic elements and on-chip RAM are required.
• High-density I/O bridging  Acts as an interface hub for boards requiring extensive I/O connectivity and flexible signal routing.
• Embedded system prototyping  Provides a scalable platform for prototype and proof-of-concept development that requires substantial on-chip resources.

Unique Advantages

• High logic density: 162,240 logic elements enable large-scale designs without external logic expansion.
• Substantial embedded memory: Approximately 11.98 Mbits of on-chip RAM reduces reliance on external memory and simplifies data buffering.
• Generous I/O count: 400 I/O pins support complex board-level interfacing and multiple parallel connections.
• Compact, high-ball-count package: The 676‑FCBGA (27×27) package delivers a dense footprint for space-constrained PCB layouts.
• Commercial temperature and RoHS compliance: Suitable for a wide range of commercial applications with compliant materials and standard operating range.

Why Choose XC7K160T-2FFG676C?

The XC7K160T-2FFG676C combines a large logic fabric, nearly 12 Mbits of embedded RAM, and a 400-pin I/O complement in a 676‑ball FCBGA package, delivering a balanced platform for commercial programmable-logic designs. Its specified core voltage range and surface-mount form factor make it practical for integration into constrained power and PCB budgets.

This device is well suited to engineering teams and procurement groups that need a commercially graded FPGA with substantial on-chip resources and a compact, high-density package. It provides a scalable option for designs that require significant logic and memory capacity while remaining within standard commercial temperature and assembly constraints.

Request a quote or submit a purchase inquiry to discuss availability, pricing, and lead times for the XC7K160T-2FFG676C. Our team can provide the necessary product and procurement details to support your design and production planning.