XC7K160T-3FBG484E

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA

Quantity 1,346 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-3FBG484E – Kintex®-7 Field Programmable Gate Array (FPGA) IC

The XC7K160T-3FBG484E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 484-pin FCBGA package. It provides a substantial on-chip resource set—162,240 logic elements and approximately 12 Mbits of embedded RAM—along with 285 I/O pins to support complex digital designs.

Designed for developers who need significant logic density and embedded memory within a compact surface-mount package, this device operates from a core voltage range of 0.970 V to 1.03 V and is specified for 0 °C to 100 °C operating temperature with an Extended grade.

Key Features

  • Core Logic  162,240 logic elements provide substantial programmable logic capacity for complex functions and custom hardware acceleration.
  • Embedded Memory  Approximately 12 Mbits of on-chip RAM (11,980,800 bits) for buffering, data storage, and state retention without external memory.
  • I/O Count  285 user I/O pins to support multi-channel interfaces, parallel buses, and mixed-signal front ends at the board level.
  • Power  Core supply voltage range of 0.970 V to 1.03 V for compatibility with low-voltage system rail designs.
  • Package & Mounting  484-FCBGA package (484-BBGA notation, 23 × 23 mm supplier package) in a surface-mount form factor for compact PCB integration.
  • Temperature & Grade  Specified operating temperature range of 0 °C to 100 °C and Extended grade for applications within that thermal envelope.
  • Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic and memory density: 162,240 logic elements paired with approximately 12 Mbits of embedded RAM enable integration of sizable digital functions on a single device.
  • Generous I/O provisioning: 285 I/O pins offer flexibility for interfacing multiple peripherals, parallel data paths, or complex I/O standards at the board level.
  • Compact, surface-mount BGA: 484-FCBGA (23 × 23 mm) package balances high pin count with a small PCB footprint for space-constrained systems.
  • Low-voltage core: Narrow core supply range (0.970 V–1.03 V) supports modern low-voltage power architectures and efficient power delivery design.
  • Extended temperature operation: Rated 0 °C to 100 °C to support designs that operate across typical commercial-to-extended ambient ranges.
  • RoHS compliance: Meets common environmental manufacturing standards to simplify supply-chain integration.

Why Choose XC7K160T-3FBG484E?

The XC7K160T-3FBG484E positions itself as a high-capacity Kintex®-7 FPGA option where substantial logic density, embedded memory, and broad I/O are required within a compact surface-mount BGA package. Its combination of 162,240 logic elements, approximately 12 Mbits of on-chip RAM, and 285 I/O pins enables consolidation of complex digital functions and reduces external component count.

Engineers and procurement teams seeking a device specified for 0 °C to 100 °C operation, RoHS compliance, and a low-voltage core supply will find this part suitable for deployments that need reliable, high-density programmable logic in a 484-FCBGA (23 × 23 mm) form factor.

Request a quote for XC7K160T-3FBG484E or submit an inquiry with your quantity and delivery requirements to receive pricing and availability information.

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