XC7K160T-2FFG676I

The XC7K160T-2FFG676I is an industrial-grade Kintex®-7 field programmable gate array (FPGA) in a 676-FCBGA package (27×27). It provides a large programmable fabric with 162,240 logic elements and approximately 11.98 Mbits of embedded memory, suited for systems that require substantial on-chip logic and memory resources.

Key device attributes include support for up to 400 I/Os, a low-voltage core supply range of 0.97 V to 1.03 V, and an operating temperature range of −40 °C to 100 °C, making it appropriate for industrial deployments that demand robust thermal and electrical operating margins.

Key Features

• Core Logic 162,240 logic elements provide a high-density programmable fabric for complex logic and custom processing implementations.
• Embedded Memory Approximately 11.98 Mbits of on-chip RAM to support data buffering, lookup tables, and intermediate storage without external memory.
• I/O Density Up to 400 general-purpose I/Os to interface with sensors, peripherals, and other system components.
• Package & Mounting 676-BBGA (FCBGA) package, supplier package 676-FCBGA (27×27), optimized for surface-mount assembly and high-density board layouts.
• Power Core voltage supply range of 0.97 V to 1.03 V to match system power-rail planning and margining.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for use in demanding environmental conditions.
• Regulatory RoHS compliant for environmental and regulatory alignment in product manufacturing.

Typical Applications

• Industrial Automation Use the device where industrial-grade thermal performance and extensive I/O connectivity are required for control, monitoring, and programmable logic tasks.
• High-density Logic Implementations Designs that require large on-chip logic capacity—up to 162,240 logic elements—and embedded memory for custom processing and protocol handling.
• Platform and System Integration Systems that need numerous I/O channels (up to 400) and a compact FCBGA package for integration into space-constrained PCBs.

Unique Advantages

• High logic capacity: 162,240 logic elements enable implementation of complex finite state machines, datapaths, and custom accelerators without external logic chips.
• Substantial embedded memory: Approximately 11.98 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage, simplifying BOM and board routing.
• Robust I/O count: Up to 400 I/Os support extensive peripheral and interface connectivity for multi-channel systems.
• Industrial operating range: −40 °C to 100 °C rating and industrial grade designation help ensure operation in harsher environments.
• Compact, assembly-friendly package: 676-FCBGA (27×27) surface-mount package enables high-density PCB layouts while supporting standard SMT assembly processes.
• Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose XC7K160T-2FFG676I?

The XC7K160T-2FFG676I positions itself as a high-capacity, industrial-grade FPGA option for designers who require a large programmable fabric, substantial embedded memory, and extensive I/O in a compact FCBGA package. Its specified core voltage range and wide operating temperature make it a practical choice for industrial systems that demand predictable electrical and thermal behavior.

This device is well suited to development teams and product designs that prioritize on-chip integration of logic and memory to reduce external components, simplify board design, and maintain operational robustness across a broad temperature range.

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