XC7K160T-L2FFG676I

The XC7K160T-L2FFG676I is a Kintex®-7 family field programmable gate array (FPGA) manufactured by AMD. It provides large programmable logic capacity, substantial embedded memory, and a high count of user I/O for designs that require significant on-chip resources.

This device targets applications that benefit from high logic density, approximately 11.98 Mbits of embedded memory, and support for up to 400 I/Os, while meeting industrial temperature and RoHS requirements.

Key Features

• Core Logic  162,240 logic cells provide substantial programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 11.98 Mbits of embedded memory (11,980,800 bits) for buffering, FIFOs, and on-chip data storage.
• I/O Resources  Up to 400 user I/Os to support wide connectivity and multiple parallel interfaces.
• Power  Core supply range of 870 mV to 930 mV to support the device's internal power requirements.
• Package and Mounting  676‑FCBGA (27×27) / 676‑BBGA package in a surface-mount form factor for board-level integration.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for environmental and regulatory adherence.

Typical Applications

• Industrial Control  Deployable in industrial environments where broad temperature range and industrial-grade components are required for automation and control systems.
• High‑Density Logic Systems  Suitable for designs that require large amounts of programmable logic to implement custom processors, accelerators, or complex state machines.
• Memory‑Intensive Processing  Useful where on-chip memory can reduce external memory dependency for buffering and data handling.
• I/O‑Rich Interfaces  Ideal for systems that need many parallel or mixed I/O connections, leveraging up to 400 user I/Os for peripheral and interface routing.

Unique Advantages

• High logic density: 162,240 logic cells enable complex functions and high levels of integration on a single device, reducing system component count.
• Substantial on‑chip memory: Approximately 11.98 Mbits of embedded memory supports buffering and local data storage to improve system responsiveness.
• Large I/O capacity: 400 user I/Os provide flexibility for interfacing multiple peripherals, parallel buses, and custom I/O protocols.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact surface‑mount FCBGA package: The 676‑FCBGA (27×27) package offers a high-pin-count solution in a board-friendly surface-mount format.
• RoHS compliant: Meets RoHS environmental standards for lead-free manufacturing requirements.

Why Choose XC7K160T-L2FFG676I?

The XC7K160T-L2FFG676I balances high logic capacity, significant embedded memory, and extensive I/O in a single industrial‑grade Kintex®-7 FPGA. Its combination of 162,240 logic cells, approximately 11.98 Mbits of on‑chip memory, and up to 400 I/Os make it well suited for designs that require consolidation of functions, flexible interfacing, and operation across a wide temperature range.

As a member of the Kintex®-7 family from AMD, this device offers a compact, surface‑mount 676‑FCBGA package and RoHS compliance, delivering a viable option for engineers seeking long-term scalability and robust board-level integration in industrial and high-density logic applications.

Request a quote or submit an inquiry to discuss availability, pricing, and how XC7K160T-L2FFG676I can fit into your next design.