XC7K325T-1FB900I

The XC7K325T-1FB900I is a Kintex®-7 family Field Programmable Gate Array (FPGA) in a 900-FCBGA (31×31) surface-mount package. It provides a high logic capacity of 326,080 logic elements and approximately 16.4 Mbits of embedded memory, together with up to 500 I/O pins.

Designed for industrial environments, the device supports a supply voltage range of 0.970 V to 1.03 V and an operating temperature range from -40 °C to 100 °C. RoHS compliance is indicated for environmental conformity.

Key Features

• Core Architecture Kintex®-7 FPGA architecture in a surface-mount FCBGA package offering a configurable logic fabric for custom digital designs.
• Logic Density 326,080 logic elements to implement complex logic functions and system-level integration on a single device.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• High I/O Count Up to 500 I/O pins to support multiple parallel interfaces and dense board-level connectivity.
• Package and Mounting 900-BBGA / 900-FCBGA (31×31) supplier package in a surface-mount form factor for high pin-count designs.
• Power Core voltage supply range of 0.970 V to 1.03 V to match system power domains and regulator selections.
• Operating Range and Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C suitable for demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems Use the industrial temperature range and high I/O count for control interfaces, sensor aggregation, and real-time logic in factory and process automation.
• Embedded Processing and Acceleration Leverage 326,080 logic elements and approximately 16.4 Mbits of embedded memory to implement custom accelerators and data-paths.
• High-Density I/O Platforms The 500 available I/O pins in a compact 900-FCBGA package enable dense interface routing for multi-channel applications.

Unique Advantages

• High Logic Capacity: 326,080 logic elements allow consolidation of large logic functions and reduce the need for multiple devices.
• Substantial On-Chip Memory: Approximately 16.4 Mbits of RAM supports buffering and local data storage for latency-sensitive tasks.
• Robust Industrial Operation: Specified for -40 °C to 100 °C operation to meet environmental demands in industrial deployments.
• High I/O Density in a Compact Package: Up to 500 I/O in a 900-FCBGA (31×31) package enables dense external connectivity while maintaining a compact board footprint.
• Controlled Core Supply Range: Core voltage support from 0.970 V to 1.03 V for predictable integration with system power rails.
• RoHS Compliant: Meets environmental conformity requirements for lead-free manufacturing.

Why Choose XC7K325T-1FB900I?

The XC7K325T-1FB900I combines a high logic element count, substantial embedded memory, and a 500-pin I/O complement in a 900-FCBGA surface-mount package, providing a scalable platform for complex digital designs. Its industrial operating range and RoHS compliance make it suitable for long-term deployments in demanding environments.

This device is well suited for designers and system integrators who need on-chip capacity for custom logic, significant local memory, and flexible I/O in a compact, industrial-grade package while maintaining clear power supply requirements.

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