XC7K325T-1FBG900I

The XC7K325T-1FBG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It delivers a high logic capacity with 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and up to 500 general-purpose I/Os, making it suitable for complex, high-density digital designs.

Built for reliable operation across a wide temperature range and a tight core supply window, this 900‑FCBGA, surface-mount FPGA balances integration and robustness for industrial environments.

Key Features

• Core Logic  326,080 logic elements provide substantial programmable fabric for custom digital logic implementations.
• Configurable Logic Blocks  25,475 CLB-like resources (as specified) to support large-scale combinational and sequential logic structures.
• On-chip Memory  Approximately 16.4 Mbits of embedded RAM for data buffering, packet storage, and intermediate processing.
• I/O Capacity  Up to 500 I/Os to accommodate dense interfacing requirements with peripherals, sensors, and external logic.
• Power Supply  Core supply range 0.970 V to 1.03 V to match precise power domains and system power designs.
• Package & Mounting  900‑FBG/FCBGA (31 × 31 mm) package in a surface-mount format for compact board-level integration.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and extensive I/O count support control logic, sensor aggregation, and interface bridging in automation systems.
• High-density Digital Systems  Large logic element count and substantial embedded RAM enable complex protocol handling, packet processing, and custom signal processing functions.
• Communication and Interface Aggregation  Up to 500 I/Os allow flexible connectivity for aggregating multiple serial, parallel, or custom interface blocks on a single device.

Unique Advantages

• High Logic Capacity: 326,080 logic elements provide the headroom to implement large, multi-function designs without immediate migration to larger families.
• Significant On-chip Memory: Approximately 16.4 Mbits of embedded memory reduces dependency on external RAM for buffering and intermediate storage.
• Extensive I/O Count: 500 I/Os simplify board-level design by consolidating multiple interfaces into a single programmable device.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, Surface-mount Packaging: 900‑FCBGA (31 × 31 mm) package enables dense PCB layouts while maintaining robust soldered mounting.
• RoHS Compliance: Meets common environmental requirements for modern electronics manufacturing.

Why Choose XC7K325T-1FBG900I?

The XC7K325T-1FBG900I positions itself as a high-capacity, industrial-grade Kintex®-7 FPGA that combines extensive programmable logic, ample embedded memory, and a large I/O footprint in a compact 900‑FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for robust, long-life deployments where stability and integration matter.

This device is well suited to engineering teams developing complex digital systems that require on-chip memory, dense interfacing, and reliable operation across industrial temperature ranges. The combination of logic density, I/O flexibility, and package integration supports scalable designs and helps reduce board-level component count.

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