XC7K325T-1FBG676C

The XC7K325T-1FBG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a large programmable fabric with 326,080 logic elements and approximately 16.4 Mbits of embedded RAM in a 676-FCBGA (27×27) surface-mount package.

This commercial-grade device features 400 I/Os, a core voltage supply range of 970 mV to 1.03 V, an operating temperature range of 0 °C to 85 °C, and RoHS compliance—making it suitable for a wide range of standard electronic designs that require substantial on-chip logic and memory resources.

Key Features

• Core / Logic Density 326,080 logic elements (cells) providing substantial programmable logic capacity for complex designs.
• Embedded Memory Approximately 16.4 Mbits of total on-chip RAM (16,404,480 bits) for on-chip data storage and buffering.
• I/O Count 400 user I/Os to support multiple peripheral and interface connections.
• Package and Mounting 676-BBGA, FCBGA package in a 676-FCBGA (27×27) supplier device package; surface-mount mounting for PCB assembly.
• Power Core voltage supply range from 970 mV to 1.03 V for defined core power design.
• Operating Range and Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High programmable capacity: 326,080 logic elements enable implementation of complex FPGA functions without partitioning designs across multiple devices.
• Significant on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces dependence on external memory for many data-intensive tasks.
• Broad I/O provision: 400 I/Os simplify routing and interface options for multi-signal systems.
• Compact surface-mount package: 676-FCBGA (27×27) provides a high-density footprint suitable for space-constrained PCBs.
• Defined power and thermal bounds: Core supply range of 970 mV–1.03 V and a 0 °C–85 °C operating window support predictable power and thermal planning for commercial applications.

Why Choose XC7K325T-1FBG676C?

The XC7K325T-1FBG676C delivers a combination of high logic density, substantial embedded memory, and a generous I/O count in a compact 676-FCBGA surface-mount package. As a commercial-grade Kintex®-7 FPGA, it is positioned for designs that require on-chip resources and predictable operating characteristics within the 0 °C to 85 °C range.

For projects that demand significant programmable fabric and on-chip RAM while maintaining a controlled core power design and RoHS compliance, this part offers a clear specification-driven option that can simplify board-level integration and resource planning.

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