XC7K325T-1FBG676I

The XC7K325T-1FBG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering high logic capacity and substantial on-chip memory in a 676‑FCBGA package. Designed as a configurable logic device, it provides a combination of a large number of logic elements, embedded RAM, and a broad I/O count for complex digital designs.

Key device attributes available from the specification include 326,080 logic elements, approximately 16.4 Mbits of embedded memory, 400 I/Os, industrial-grade operating temperature, and a 676‑ball FCBGA (27 × 27 mm) package, enabling robust system integration and reliable operation across a wide temperature range.

Key Features

• Core Logic 326,080 logic elements (cells) provide a high-density fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic tasks without external memory dependence.
• I/O Capacity 400 user I/Os to support extensive interfacing and parallel connectivity to peripherals, sensors, and external logic.
• Power Supply Range Core voltage supply specified from 970 mV to 1.03 V, enabling precise power domain design and predictable core behavior.
• Package & Mounting 676‑BBGA (FCBGA) supplier device package, 676‑FCBGA (27×27 mm), in a surface-mount form factor for high-density PCB assembly.
• Industrial Temperature Grade Rated for operation from -40 °C to 100 °C to meet temperature stability requirements for industrial environments.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High integration density: 326,080 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM support data buffering and stateful processing without immediate reliance on external memory components.
• Extensive I/O connectivity: 400 I/Os facilitate broad external interfacing and parallel data paths for system-level flexibility.
• Industrial-grade operation: Specified -40 °C to 100 °C operation addresses thermal robustness required in demanding environments.
• Compact, surface-mount packaging: 676‑FCBGA (27×27 mm) package offers a space-efficient footprint for high-density board designs.
• Clear power specifications: Defined core voltage range (970 mV–1.03 V) supports predictable power design and integration.

Why Choose XC7K325T-1FBG676I?

The XC7K325T-1FBG676I positions itself as a high-capacity Kintex‑7 FPGA option for designs that require large logic resources, significant embedded memory, and a high number of I/Os in a compact FCBGA package. Its industrial temperature rating and defined core voltage range provide predictable behavior for long-term deployment in temperature-challenging applications.

This device is suited to development teams and system designers who need a single-component solution to consolidate complex logic, memory buffering, and wide external connectivity while maintaining surface-mount board compatibility and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability details for the XC7K325T-1FBG676I and to discuss how this Kintex‑7 FPGA can be integrated into your next design.