XC7K325T-1FF676I

The XC7K325T-1FF676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD offered in a 676-ball FCBGA package. It delivers large programmable logic capacity, significant on-chip memory, and a high I/O count suitable for industrial-grade electronic designs.

Built for designs that require substantial logic and memory resources with industrial operating capability, this device combines 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 400 I/O pins in a surface-mount 676-FCBGA (27×27) package.

Key Features

• Logic Capacity – 326,080 logic elements provide extensive programmable resources for complex digital designs.
• Embedded Memory – Approximately 16.4 Mbits of on-chip RAM (16,404,480 bits) for data buffering and on-chip storage.
• I/O Resources – 400 user I/O pins to support broad interfacing and system integration requirements.
• Power Supply Range – Core voltage specified from 0.970 V to 1.03 V to match system power design constraints.
• Package and Mounting – 676-FCBGA (27×27) / 676-BBGA package in a surface-mount format for PCB assembly.
• Industrial Grade and Temperature Range – Rated operating temperature from −40 °C to 100 °C and designated as industrial grade for demanding environments.
• Regulatory Compliance – RoHS compliant to support environmental and manufacturing requirements.

Unique Advantages

• Large programmable fabric: 326,080 logic elements enable implementation of substantial custom logic and system functions on a single device.
• Significant on-chip memory: Approximately 16.4 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage needs.
• High I/O density: 400 I/O pins provide flexibility for connecting peripherals, sensors, and external interfaces without additional multiplexing.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in environments requiring extended temperature performance.
• Compact FCBGA package: 676-FCBGA (27×27) surface-mount package balances integration density with standard PCB assembly workflows.
• RoHS compliance: Supports environmental compliance objectives in product manufacturing.

Why Choose XC7K325T-1FF676I?

The XC7K325T-1FF676I positions itself as an industrial-grade Kintex®-7 FPGA solution that brings together a high logic element count, substantial embedded memory, and a large I/O complement in a 676-FCBGA surface-mount package. These characteristics make it well suited for designs that require on-chip capacity and robust operating temperature support.

For engineering teams and procurement looking for an FPGA with verified industrial temperature range, RoHS compliance, and clear device-level specifications (logic elements, RAM bits, I/O count, package and voltage range), the XC7K325T-1FF676I delivers a concise combination of resources to support complex digital designs.

Request a quote or submit a sales inquiry to evaluate XC7K325T-1FF676I for your next design; include required quantities and delivery timeline to receive a prompt response.