XC7K325T-1FFG676CES9937

The XC7K325T-1FFG676CES9937 is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, provided in a 676-ball FCBGA package (27 × 27). It combines a large programmable logic capacity with substantial embedded memory and abundant I/O to support complex, board-level digital designs.

Designed for commercial-grade applications, this device targets systems that require high integration of logic, memory and I/O while maintaining a defined core voltage range and surface-mount packaging for standard PCB assembly.

Key Features

• Core & logic capacity  Contains 326,080 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded memory  Provides approximately 16.4 Mbits of on-chip RAM for buffering, lookup tables and state storage.
• I/O resources  Up to 400 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power supply  Core operating range specified from 970 mV to 1.03 V to match board power-rail requirements.
• Package & mounting  676-ball FCBGA (27 × 27) package in a surface-mount format for reliable, high-density board integration.
• Operating range & grade  Commercial temperature rating with an operating range of 0 °C to 85 °C suitable for standard industrial and commercial electronics.
• RoHS compliance  Designed and supplied in compliance with RoHS requirements.

Typical Applications

• High-density logic processing  Use the large logic element count for custom compute blocks, hardware acceleration and signal processing pipelines.
• Memory-intensive buffering  On-chip memory supports packet buffering, frame storage and intermediate data staging in streaming applications.
• Multi-interface systems  The 400 I/O pins accommodate parallel data busses, control signals and external peripheral interfaces.

Unique Advantages

• High integration: Combines hundreds of thousands of logic elements and multi-megabit embedded memory in a single FCBGA package, reducing external component count.
• Flexible I/O capacity: 400 I/O pins enable complex board-level interfacing without extensive external multiplexing.
• Compact surface-mount package: 676-ball FCBGA (27 × 27) allows dense PCB layouts while supporting automated assembly processes.
• Defined core voltage window: Specified 970 mV–1.03 V supply range simplifies power-rail design and verification.
• Commercial temperature rating: Rated 0 °C–85 °C for deployment in standard commercial and many industrial environments.
• Regulatory readiness: RoHS compliance supports use in markets requiring lead-free assembly.

Why Choose XC7K325T-1FFG676CES9937?

This Kintex®-7 FPGA delivers a combination of large logic capacity, significant embedded memory and extensive I/O in a compact FCBGA package, making it well suited to designs that require substantial on-chip resources for custom digital processing and interfacing. Its commercial-grade temperature range and defined power requirements make it appropriate for a wide range of standard electronic systems.

For teams building high-density, feature-rich boards that need scalable logic and memory on a single device, the XC7K325T-1FFG676CES9937 offers a balanced platform for consolidating functions and simplifying board-level architectures.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7K325T-1FFG676CES9937 and start integrating it into your next design.