XC7K325T-1FFG676C

IC FPGA 400 I/O 676FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 16404480 326080 676-BBGA, FCBGA

Quantity 383 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs25475Number of Logic Elements/Cells326080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits16404480

Overview of XC7K325T-1FFG676C – Kintex®-7 Field Programmable Gate Array (FPGA) 676-FCBGA

The XC7K325T-1FFG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) in a high-pin-count 676-FCBGA package. It delivers a combination of large logic capacity, substantial on-chip memory, and a broad I/O count in a commercial-grade, surface-mount device.

Key device attributes include 326,080 logic elements, approximately 16.4 Mbits of embedded memory, 400 I/O pins, a supply voltage range of 970 mV to 1.03 V, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core logic capacity 326,080 logic elements to support complex programmable logic implementations.
  • Embedded memory Approximately 16.4 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
  • High I/O count 400 available I/O pins to accommodate wide parallel interfaces and multiple external peripherals.
  • Package and mounting 676-FCBGA (27×27) package; package case listed as 676-BBGA, FCBGA, designed for surface-mount assembly.
  • Power supply Core supply range from 970 mV to 1.03 V for the device core domain.
  • Operating range and grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental compliance RoHS-compliant to meet lead-free and environmental requirements.

Unique Advantages

  • High logic density: 326,080 logic elements provide capacity for sizeable FPGA designs without changing package family.
  • Significant on-chip RAM: Approximately 16.4 Mbits of embedded memory reduces the need for external RAM in many designs.
  • Extensive I/O connectivity: 400 I/O pins enable flexible interfacing to a variety of external devices and parallel buses.
  • Compact, high-pin-count package: 676-FCBGA (27×27) delivers many signals in a compact footprint suitable for surface-mount assembly.
  • Clear supply and thermal boundaries: Defined core voltage range (970 mV–1.03 V) and commercial operating temperature (0 °C–85 °C) simplify design validation for commercial applications.
  • RoHS compliance: Environmentally compliant manufacturing and assembly compatibility.

Why Choose XC7K325T-1FFG676C?

The XC7K325T-1FFG676C is positioned for designers who require a commercial-grade FPGA with large logic resources, substantial embedded memory, and a high I/O count in a 676-ball FCBGA package. Its specified core voltage range and 0 °C to 85 °C operating window make it suitable for a wide range of commercial embedded systems.

Selecting this Kintex®-7 device supports designs where on-chip resources reduce external component count and where a high number of I/Os and logic elements are essential for system integration and scalability.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7K325T-1FFG676C.

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