XC7K325T-1FFG900C

The XC7K325T-1FFG900C is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD. It provides a large programmable fabric with 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 500 user I/Os in a 900-FCBGA (31×31) surface-mount package.

Specified for a core supply range of 0.97–1.03 V and a commercial operating temperature of 0 °C to 85 °C, this RoHS-compliant device delivers a high-density, high-I/O-count platform for complex digital designs that require substantial on-chip resources.

Key Features

• Kintex‑7 FPGA fabric Large programmable fabric supporting complex logic implementations with 326,080 logic elements.
• Embedded memory Approximately 16.4 Mbits of on-chip RAM for buffering, data storage, and state retention within the FPGA design.
• High I/O count 500 user I/Os to support broad external device interfacing and high-pin-count system requirements.
• Power supply Core voltage supply specified at 0.97 V to 1.03 V to support the device’s power delivery and design planning.
• Package and mounting 900-FCBGA (31×31) / 900-BBGA package in a surface-mount configuration for dense PCB integration.
• Operating grade and temperature Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental compliance RoHS-compliant construction to meet common environmental requirements.

Unique Advantages

• High logic capacity: 326,080 logic elements enable consolidation of large digital functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage needs.
• Extensive I/O resources: 500 user I/Os provide flexibility for interfacing multiple peripherals, sensors, or high-pin-count subsystems.
• Compact, high-pin-count package: 900-FCBGA (31×31) offers a high-density solution for space-constrained, high-performance PCBs.
• Predictable power envelope: Tight core voltage range (0.97–1.03 V) simplifies power-supply design and budgeting.
• Commercial-grade reliability and compliance: 0 °C to 85 °C operating range and RoHS compliance support typical commercial product requirements.

Why Choose XC7K325T-1FFG900C?

The XC7K325T-1FFG900C positions itself as a high-density Kintex‑7 FPGA for designs that demand extensive logic, memory, and I/O resources in a single, surface-mount package. Its combination of 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 500 I/Os supports consolidation of complex digital functions and reduces the need for additional discrete components.

As a commercial-grade, RoHS-compliant device with a defined core voltage range and a compact 900-FCBGA package, this part is suited to system-level designs where on-chip capacity, I/O density, and board-space efficiency are primary considerations.

Request a quote or submit an availability inquiry for the XC7K325T-1FFG900C to receive pricing and lead-time information.