XC7K325T-1FFG900I

The XC7K325T-1FFG900I is a Kintex®-7 field programmable gate array (FPGA) IC from AMD optimized for high-density logic and I/O integration in industrial designs. It combines a large logic fabric with substantial on-chip memory and a 500-pin I/O complement to support complex, I/O‑heavy applications.

Designed for surface-mount deployment in a 900‑pin FCBGA package, this industrial‑grade device provides verified operating ranges for core voltage and temperature to support robust system operation.

Key Features

• Core Logic  Approximately 326,080 logic elements for implementing large-scale programmable logic and custom hardware functions.
• Embedded Memory  Approximately 16.4 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Capacity  500 general-purpose I/O to accommodate dense interface requirements and multiple high-pin-count peripherals.
• Power  Core supply range from 970 mV to 1.03 V for defined power delivery and core-voltage planning in system designs.
• Package & Mounting  900‑FBGA/900‑BBGA FCBGA package (900‑FCBGA, 31 × 31) designed for surface-mount assembly in space-constrained boards.
• Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Compliance  RoHS‑compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Leverage abundant logic elements and embedded RAM for custom signal processing, data path acceleration, and control logic.
• Networking and communications  Use the large I/O complement to implement multi‑lane interfaces, protocol bridging, and packet processing functions.
• Industrial automation and control  Deploy in industrial control systems where the industrial temperature rating, logic capacity, and I/O density enable reliable machine and process control.
• Custom hardware acceleration  Implement application‑specific accelerators and offload compute-intensive tasks to the programmable fabric.

Unique Advantages

• High logic density: The large logic element count enables consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: 500 I/O pins simplify connectivity to sensors, transceivers, and peripherals without requiring external multiplexing.
• Industrial temperature support: Rated −40 °C to 100 °C to support deployment in demanding environmental conditions.
• Compact, production-ready package: 900‑FCBGA (31 × 31) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory readiness: RoHS compliance aligns with common manufacturing and environmental requirements.

Why Choose XC7K325T-1FFG900I?

The XC7K325T-1FFG900I positions itself as a high-density, industrial-grade FPGA option that balances substantial programmable logic, embedded memory, and a large I/O complement in a compact FCBGA package. Its defined core voltage range and extended operating temperature make it suitable for robust system designs that require predictable power and environmental behavior.

This device is appropriate for engineers seeking to consolidate complex digital functions, enable custom hardware acceleration, or implement multi-interface systems while maintaining industrial operating parameters and RoHS compliance.

Request a quote or submit a purchase inquiry to evaluate the XC7K325T-1FFG900I for your next high-density, industrial FPGA design.