XC7K325T-2FBG676I

The XC7K325T-2FBG676I is a Kintex®-7 field programmable gate array (FPGA) by AMD provided in a 676‑ball FCBGA surface-mount package. The device delivers high logic density and on‑chip memory capacity in an industrial‑grade component designed for board‑level integration.

Key published attributes include 326,080 logic elements, approximately 16.4 Mbits of embedded memory, 400 user I/O, a 676‑FCBGA (27×27) package, a supply voltage range of 970 mV to 1.03 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Architecture Kintex‑7 FPGA family device delivering programmable logic capacity for complex digital implementations.
• Logic Capacity 326,080 logic elements to support large, high‑density designs.
• Embedded Memory Approximately 16.4 Mbits of on‑chip RAM for buffering, storage, and state machine implementations.
• I/O 400 user I/O pins to accommodate multi‑channel interfaces and extensive peripheral connectivity.
• Power Core supply voltage range from 970 mV to 1.03 V for compatibility with specified power delivery designs.
• Package and Mounting 676‑FCBGA (27×27) surface‑mount package offering a compact footprint for board‑level integration.
• Temperature and Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• High‑density digital systems — Use the device where substantial logic resources and on‑chip memory are required to implement complex algorithms and state machines.
• I/O‑intensive interfaces — 400 I/O pins support designs that require multiple parallel interfaces or numerous peripheral connections.
• Industrial embedded systems — Industrial temperature rating makes the device suitable for deployed control and automation equipment operating across wide ambient ranges.

Unique Advantages

• High logic integration: 326,080 logic elements enable consolidation of large digital functions onto a single device, reducing board-level component count.
• Substantial on‑chip memory: Approximately 16.4 Mbits of embedded RAM supports buffering and local data storage without external memory in many designs.
• Extensive I/O: 400 user I/O pins simplify connection to multiple peripherals and interfaces, reducing the need for additional I/O expanders.
• Compact FCBGA package: 676‑ball FCBGA (27×27) provides a space-efficient form factor for high-density boards.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
• Controlled core supply range: 970 mV to 1.03 V supply specification aids predictable power design and delivery.

Why Choose XC7K325T-2FBG676I?

The XC7K325T-2FBG676I combines substantial logic capacity, meaningful on‑chip RAM, and a high I/O count in a compact 676‑FCBGA package, available as an industrial‑grade component from AMD's Kintex‑7 family. It is well suited for designs that require consolidated digital resources, significant embedded memory, and broad connectivity while maintaining a small board footprint.

For engineering teams targeting scalable, high‑density FPGA implementations in industrial environments, this device offers a balance of integration and specification-driven predictability for long‑term deployments.

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