XC7K325T-2FF676I

The XC7K325T-2FF676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 676-ball FCBGA package. It provides a high-density programmable logic fabric with substantial embedded memory and extensive I/O for demanding industrial applications.

With a wide operating temperature range and a low-voltage supply window, this device targets designs that require significant logic capacity, on-chip memory, and robust I/O integration within a surface-mount, industrial-grade package.

Key Features

• Logic Capacity — 326,080 logic elements to support large-scale programmable logic implementations and complex combinational/sequential designs.
• Configurable Logic Blocks (CLBs) — 25,475 CLBs for modular, high-density logic partitioning and resource allocation.
• Embedded Memory — Approximately 16.4 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — 400 I/O pins to accommodate extensive peripheral, interface, and system interconnect requirements.
• Power — Core supply operating range from 0.970 V to 1.03 V for designs that require defined low-voltage core operation.
• Package — 676-FCBGA (27×27) surface-mount package (676-BBGA, FCBGA) for compact board-level integration.
• Temperature Range — Industrial operating range from −40°C to 100°C to suit temperature-demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device's high logic and I/O density for real-time control, automation logic, and digital interfacing in industrial environments.
• Data Acquisition and Processing — Leverage the embedded memory and large logic fabric for on‑board preprocessing, buffering, and custom data pipelines.
• Communications and Networking — Employ the extensive I/O and programmable logic to implement protocol bridging, packet processing, and interface adaptation.
• Custom Hardware Acceleration — Implement application-specific accelerators and offload tasks to the FPGA fabric using its large logic and memory resources.

Unique Advantages

• High logic density: 326,080 logic elements provide capacity for complex, multi-function designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces dependency on external memory for low-latency storage and buffering.
• Extensive I/O count: 400 I/O pins enable direct interfacing to a wide range of peripherals and subsystems, simplifying board-level routing.
• Industrial temperature operation: −40°C to 100°C rating supports deployment in temperature-challenging environments.
• Compact, surface-mount package: 676-FCBGA (27×27) offers a balance of I/O density and PCB area efficiency for space-constrained designs.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose XC7K325T-2FF676I?

The XC7K325T-2FF676I combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 676-FCBGA package from AMD. Its industrial temperature rating and defined supply range make it suitable for designs that require reliable operation across a wide range of conditions while maintaining significant on-chip resources.

This device is well suited to engineers and product teams building complex digital systems—where integration, predictable operating parameters, and ample programmable resources drive design choices. Selecting the XC7K325T-2FF676I helps consolidate functionality into a single, industrial-grade FPGA footprint backed by AMD manufacturing.

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