XC7K325T-2FFG676C

The XC7K325T-2FFG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 676-ball FCBGA package (27×27). It delivers a high-density programmable logic fabric and significant embedded memory in a commercial-grade device tailored for system and board designers.

With 326,080 logic elements, approximately 16.4 Mbits of on-chip RAM and 400 I/O pins, this device targets commercial embedded and system-level designs that require substantial logic resources and on-chip storage while operating within a 0 °C to 85 °C temperature range.

Key Features

• Kintex®-7 FPGA core — Implements a high-density programmable logic architecture in the XC7K325T device.
• Logic capacity — 326,080 logic elements to support complex logic designs and large-scale integration.
• Embedded memory — Approximately 16.4 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
• I/O resources — 400 user I/O pins for flexible interfacing to peripherals and external devices.
• Power supply — Core voltage range specified at 0.970 V to 1.03 V for predictable power-rail design.
• Package and mounting — 676‑BBGA / 676‑FCBGA (27×27) package, surface-mount mounting type for high-density board integration.
• Operating grade — Commercial grade with specified operating temperature from 0 °C to 85 °C.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Commercial embedded systems — Use the device where substantial on-chip logic and memory are needed within commercial temperature limits.
• High-density digital processing — Implement large-scale programmable logic and data-paths using the device’s 326,080 logic elements and on-chip RAM.
• System I/O consolidation — Leverage 400 I/O pins to consolidate interfaces and reduce external component count.

Unique Advantages

• High logic density: 326,080 logic elements enable integration of complex digital functions on a single device, reducing system-level BOM and board area.
• Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM supports buffering and local storage without external memory.
• Generous I/O count: 400 I/O pins provide flexible connectivity options for multi‑interface designs.
• Compact, production-ready package: 676‑FCBGA (27×27) surface-mount package enables high-density board implementations.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for standard commercial deployments.
• Predictable power requirements: Narrow core voltage range (0.970 V–1.03 V) simplifies power-rail design and validation.

Why Choose XC7K325T-2FFG676C?

The XC7K325T-2FFG676C combines a Kintex®-7 FPGA architecture with high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package. It is positioned for commercial system designs that require on-chip resources to consolidate functionality and streamline board-level integration.

This AMD device is suitable for engineers and procurement teams building scalable, high‑capacity programmable systems who need clear, verifiable device specifications for power, temperature, logic capacity, memory and packaging.

Request a quote or contact sales to inquire about availability, lead times, and pricing for the XC7K325T-2FFG676C.