XC7K325T-2FFV900I

The XC7K325T-2FFV900I is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, offering a large programmable logic fabric and substantial embedded memory in a ball-grid array package. It is targeted at designs that require high logic capacity, significant on-chip RAM, and a dense I/O complement.

With 326,080 logic elements, approximately 16.4 Mbits of embedded RAM, and 500 I/Os, this device provides the raw resources needed to implement complex custom logic, interface-rich systems, and industrial-grade applications within a 900-FCBGA (31×31) footprint.

Key Features

• Architecture  Kintex®-7 field programmable gate array from AMD, implemented as a surface-mount IC.
• Logic Capacity  326,080 logic elements and 25,475 CLBs provide a large programmable fabric for complex designs.
• Embedded Memory  Approximately 16.4 Mbits of on-chip RAM (16,404,480 total RAM bits) for buffering, state storage, and intermediate data processing.
• I/O Density  500 I/Os to support multiple external interfaces and high-pin-count system integration.
• Package  900-FCBGA (31×31) / 900-BBGA package case optimized for high-density board implementations.
• Power  Core supply voltage range of 0.97 V to 1.03 V for power planning and system integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Custom logic and prototyping  Use the large logic capacity and embedded RAM to implement complex algorithms, state machines, and hardware prototypes.
• High-density I/O systems  500 I/Os enable bridging, protocol conversion, and multi-interface systems where dense external connectivity is required.
• Industrial control and automation  Industrial-grade temperature range and robust packaging suit control systems and factory automation equipment.
• Embedded acceleration and buffering  Significant on-chip RAM supports local data buffering and acceleration of compute kernels within an embedded system.

Unique Advantages

• High programmable capacity: 326,080 logic elements and 25,475 CLBs enable large-scale digital designs without immediate reliance on external logic.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
• Large I/O complement: 500 I/Os simplify integration of multiple peripherals, sensors, and interface standards on a single device.
• Compact, high-density package: 900-FCBGA (31×31) offers a high-pin-count solution in a compact footprint for space-constrained boards.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C to support deployment in temperature-variable environments.
• Predictable power domain: Core voltage specified at 0.97–1.03 V assists in accurate power budgeting and supply design.

Why Choose XC7K325T-2FFV900I?

The XC7K325T-2FFV900I balances large programmable logic resources, significant embedded memory, and a dense I/O count in a 900-FCBGA package, making it well suited for complex, interface-rich, and industrial applications. As a member of the Kintex®-7 family from AMD, it provides a defined set of capabilities for designers targeting high-capacity programmable solutions with controlled power and temperature characteristics.

This device appeals to development teams and procurement groups that require measurable on-chip resources—logic elements, RAM bits, and I/O—alongside industrial temperature tolerance and RoHS compliance for long-term deployment and maintainable BOM design.

Request a quote or submit an RFQ for the XC7K325T-2FFV900I to obtain pricing, availability, and lead-time information tailored to your project requirements.