XC7K325T-L2FBG676E

The XC7K325T-L2FBG676E is a Kintex®-7 family field programmable gate array (FPGA) offered in a 676-ball fine-pitch BGA package. It provides a large on-chip resource set including 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 400 user I/Os for designs that require high logic and I/O density.

This device is supplied for surface-mount PCB assembly in a 676-FCBGA (27×27) package, operates with a core voltage range of 970 mV to 1.03 V, and is specified for operation from 0 °C to 100 °C with an Extended grade and RoHS compliance.

Key Features

• Core Logic 326,080 logic elements (cells) provide substantial capacity for complex programmable logic implementations.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM for buffering, state storage, and local data processing without external memory.
• I/O Count 400 user I/Os to support high-density interfacing to peripherals, sensors, and other system components.
• Package and Mounting 676-BBGA / 676-FCBGA (27×27) in a surface-mount form factor to fit compact, high-density board layouts.
• Power Supply Core voltage specified between 970 mV and 1.03 V to match system power delivery design requirements.
• Operating Range & Grade Extended grade device rated for 0 °C to 100 °C operation, suitable for applications within that temperature window.
• Regulatory RoHS compliant, meeting common requirements for lead-free assembly.

Typical Applications

• Data Processing and Acceleration Large logic capacity and embedded memory enable implementation of application-specific data paths and buffering on-chip.
• High-Density I/O Systems 400 user I/Os support complex I/O connectivity for systems requiring numerous interfaces or parallel buses.
• Custom Logic Integration Consolidate multiple discrete functions into a single FPGA using substantial logic and memory resources to simplify board-level design.

Unique Advantages

• Substantial Logic Capacity: 326,080 logic elements allow integration of wide-ranging programmable functions within one device.
• On-Chip Memory Resources: Approximately 16.4 Mbits of embedded RAM reduce dependence on external memory for many buffering and scratchpad needs.
• High I/O Count: 400 user I/Os support extensive peripheral interfacing and flexible system partitioning.
• Compact Surface-Mount Package: 676-FCBGA (27×27) gives a balance of high integration and a board footprint suitable for dense designs.
• Controlled Power Envelope: Defined core voltage range (970 mV–1.03 V) assists in precise power-supply planning for system integration.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a broad set of commercial and extended-temperature applications.

Why Choose XC7K325T-L2FBG676E?

The XC7K325T-L2FBG676E combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 676-ball BGA package, making it well suited to designs that need dense programmable logic and extensive interfacing in a single device. Its specified core voltage range and 0 °C to 100 °C operating window provide clear electrical and thermal design parameters for system integration.

For development teams and procurement seeking a Kintex®-7 FPGA with defined resources—326,080 logic elements, approximately 16.4 Mbits of on-chip RAM, 400 I/Os, and RoHS compliance—this part delivers a verifiable set of capabilities for high-density programmable designs.

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