XC7K325T-L2FBG676I

The XC7K325T-L2FBG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD. It provides a high-density programmable logic fabric with 326,080 logic elements and approximately 16.4 Mbits of embedded memory for system-level integration.

Designed for surface-mount deployment in a 676-FCBGA package, this device targets industrial applications that require substantial I/O capacity, on-chip memory, and operation across a wide temperature and core-voltage range.

Key Features

• Programmable Logic 326,080 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Capacity 400 I/O pins for interfacing with peripherals, high-speed links, and board-level signals.
• Power Core voltage supply range from 970 mV to 1.03 V to match system power-rail requirements.
• Package & Mounting 676-BBGA / 676-FCBGA (27×27 mm) surface-mount package for compact, high-density board designs.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Implement machine logic, sensor interfacing, and deterministic control functions using the device's high logic density and robust temperature range.
• Data Processing & Acceleration — Use the abundant logic elements and on-chip RAM for custom data-paths and hardware acceleration tasks.
• High-Density I/O Systems — Leverage 400 I/O pins to connect multiple peripherals, transceivers, and board-level signals in compact designs.

Unique Advantages

• High Logic Density: 326,080 logic elements enable complex, multi-function designs without external programmable logic.
• Significant On-Chip Memory: Approximately 16.4 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Extensive I/O: 400 I/O pins support rich peripheral connectivity and flexible board-level integration.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, suitable for industrial environments where extended temperature operation is required.
• Compact Surface-Mount Package: 676-FCBGA (27×27 mm) enables high-density PCB layouts while maintaining a large programmable fabric.
• RoHS Compliance: Meets environmental regulatory requirements for many global supply chains.

Why Choose XC7K325T-L2FBG676I?

The XC7K325T-L2FBG676I balances high logic capacity, substantial embedded memory, and broad I/O resources in a single industrial-grade Kintex®-7 FPGA package. Its specified core-voltage range and extended operating temperature make it well suited to demanding embedded systems that require on-board programmability and robust operation.

Backed by AMD's Kintex®-7 product family documentation and ecosystem, this device is appropriate for engineers seeking a scalable, high-density FPGA platform for industrial control, data processing, and high-I/O applications.

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