XC7K325T-L2FFG676I

The XC7K325T-L2FFG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed for applications requiring high logic density and substantial on-chip memory. It delivers 326,080 logic elements and approximately 16.4 Mbits of embedded RAM, combined with 400 I/O pins in a 676-ball FCBGA package.

Built for industrial-grade environments, this surface-mount device operates across a wide temperature range and supports low-voltage core supply operation, making it suitable for robust, I/O‑rich designs that require configurable digital logic and memory resources.

Key Features

• Logic Capacity 326,080 logic elements to implement complex digital logic, state machines, and custom processing pipelines.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Count 400 user I/O pins to support high-density signal interfacing, parallel buses, and multi-channel I/O implementations.
• Power Supply Core voltage range specified from 970 mV to 1.03 V, enabling support for the device’s internal power requirements.
• Package and Mounting 676-BBGA / 676-FCBGA package (676-FCBGA, 27×27) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for demanding ambient conditions.
• Regulatory Compliance RoHS compliant, meeting common requirements for lead-free assembly and material restrictions.

Typical Applications

• Industrial Control and Automation Use the FPGA’s logic density and memory to implement custom control algorithms, motor control interfaces, and real-time signal processing for industrial equipment.
• High-Density I/O Systems Leverage 400 I/O pins for protocol bridging, multi-channel data acquisition, and dense peripheral interfacing.
• Embedded Logic and Acceleration Deploy on-chip logic elements and RAM for hardware-accelerated functions, custom datapaths, and embedded processing tasks.

Unique Advantages

• Substantial Logic Resources: 326,080 logic elements provide the capacity to implement large, complex designs without offloading functionality to external devices.
• Significant On-Chip Memory: Approximately 16.4 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High I/O Density: 400 I/O pins enable flexible system partitioning and support for multiple high-speed interfaces or parallel data channels.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments and ruggedized systems.
• Compact, Surface-Mount Package: 676-FCBGA (27×27) package balances high pin count with a compact PCB footprint for space-constrained designs.
• RoHS Compliant: Material compliance simplifies integration into lead-free manufacturing flows.

Why Choose XC7K325T-L2FFG676I?

This Kintex®-7 FPGA part combines a high number of logic elements, meaningful embedded memory, and a large I/O complement in an industrial-grade, surface-mount 676-FCBGA package. Its electrical and thermal specifications are suitable for engineers designing robust, configurable digital systems that require substantial on-chip resources and dense interfacing.

The XC7K325T-L2FFG676I is well suited to customers developing industrial control, high-density I/O subsystems, or hardware-accelerated processing where long-term availability, integration flexibility, and compliance with RoHS are important considerations.

Request a quote or submit a procurement inquiry to begin the sourcing process for the XC7K325T-L2FFG676I.