XC7K325T-L2FFG900E

The XC7K325T-L2FFG900E is a Kintex®-7 FPGA device from AMD designed for complex programmable logic applications. It provides a high logic capacity, substantial embedded memory, and a large number of I/O in a 900-FCBGA surface-mount package.

This device targets designs that require 326,080 logic elements, approximately 16.4 Mbits of on-chip RAM, and up to 500 I/O pins, while operating from a 870 mV to 930 mV core supply and within an operating temperature range of 0°C to 100°C.

Key Features

• Core / Logic  326,080 logic elements and 25,475 configurable logic blocks (CLBs) for implementing large-scale digital designs.
• Embedded Memory  Approximately 16.4 Mbits of on-chip RAM for buffering, state storage, and data processing.
• I/O Density  Up to 500 I/O pins to support extensive external interfacing and board-level connectivity.
• Power  Core voltage supply range of 870 mV to 930 mV to match low-voltage power domains.
• Package & Mounting  900-FCBGA (31 × 31) package in a surface-mount form factor for compact board integration.
• Temperature & Grade  Extended grade with an operating temperature range of 0°C to 100°C.
• Regulatory  RoHS compliant.

Typical Applications

• Complex digital systems  Designs that require hundreds of thousands of logic elements and thousands of CLBs for custom logic implementation.
• Memory-intensive functions  Applications that rely on embedded RAM—approximately 16.4 Mbits—for buffering and on-chip data storage.
• I/O-rich designs  Systems that need extensive external interfacing, leveraging up to 500 I/O pins in a 900-FCBGA package.

Unique Advantages

• High logic capacity: 326,080 logic elements enable large and complex designs without immediate need for external logic expansion.
• Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM reduces dependence on external memory for many applications.
• Large I/O count: Up to 500 I/O pins simplify board-level integration for multi-interface or multi-channel systems.
• Compact, manufacturable package: 900-FCBGA (31 × 31) surface-mount package supports space-constrained PCB layouts.
• Extended operating range: Extended grade and 0°C to 100°C operating temperature support a broad set of deployment environments.
• Low-voltage core: 870 mV to 930 mV supply range enables integration with low-voltage power architectures.

Why Choose XC7K325T-L2FFG900E?

The XC7K325T-L2FFG900E combines high logic density, significant on-chip memory, and a large I/O complement in a single 900-FCBGA surface-mount package. Its extended grade and defined operating-temperature and voltage ranges make it appropriate for designs that require these specific hardware characteristics.

This device is suited for engineers and teams building sizable programmable logic systems that need substantial on-chip resources and a compact package form factor. Its specification set supports scalability within designs that prioritize logic capacity, embedded RAM, and I/O availability.

Request a quote or submit a purchase inquiry to evaluate the XC7K325T-L2FFG900E for your next programmable logic design.