XC7K355T-1FFG901I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 26357760 356160 900-BBGA, FCBGA |
|---|---|
| Quantity | 1,256 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 901-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 300 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 27825 | Number of Logic Elements/Cells | 356160 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 26357760 |
Overview of XC7K355T-1FFG901I – Kintex®-7 FPGA, 356,160 logic elements, 900‑BBGA
The XC7K355T-1FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed for industrial-grade programmable-logic applications. It provides substantial on-chip resources—with 356,160 logic elements and approximately 26.4 Mbits of embedded memory—along with up to 300 user I/Os in a 900‑BBGA (FCBGA) package.
This device targets designs that require high logic capacity, significant embedded RAM, and a wide operating temperature range (−40 °C to 100 °C). The core supply voltage range is 0.97 V to 1.03 V and the part is RoHS compliant.
Key Features
- Core Logic 27,825 CLBs and 356,160 logic elements provide extensive programmable logic capacity for complex designs.
- Embedded Memory Approximately 26.4 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
- I/O and Packaging Up to 300 user I/Os in a 900‑BBGA, FCBGA package; supplier device package listed as 901‑FCBGA (31×31) to accommodate dense board layouts.
- Power Core supply voltage range from 0.97 V to 1.03 V for integration with regulated power systems.
- Industrial Temperature Range Specified operation from −40 °C to 100 °C to meet demands of temperature-varied environments.
- Mounting and Compliance Surface-mount device with RoHS compliance for modern PCB assembly and regulatory requirements.
Typical Applications
- Industrial Automation Use the XC7K355T-1FFG901I for programmable control, signal processing, and I/O expansion in industrial control systems, leveraging its industrial temperature rating and large logic and memory resources.
- Embedded Systems Implement hardware acceleration, custom peripherals, or system integration tasks where substantial on-chip RAM and logic count simplify board-level design.
- Prototyping and System Integration Deploy this FPGA for development platforms that require flexible logic resources and abundant I/O while maintaining surface-mount compatibility.
Unique Advantages
- Substantial Logic Capacity: 356,160 logic elements support large-scale logic implementations and complex state machines without offloading functions to external devices.
- Ample Embedded Memory: Approximately 26.4 Mbits of on-chip RAM reduces dependence on external memory for buffering and data storage.
- High I/O Count: Up to 300 I/Os enable connection to many peripherals and interfaces directly from the FPGA fabric.
- Industrial Temperature Stability: Rated from −40 °C to 100 °C for deployment in temperature-varied industrial environments.
- Surface-Mount Package Options: 900‑BBGA (FCBGA) / supplier 901‑FCBGA (31×31) packaging supports compact, high-density board designs.
- Regulatory Compliance: RoHS compliance supports modern environmental and manufacturing requirements.
Why Choose XC7K355T-1FFG901I?
The XC7K355T-1FFG901I combines a large pool of logic elements, substantial embedded memory, and a high I/O count in an industrial-grade FPGA package. These documented characteristics make it suitable for engineers and procurement teams seeking a programmable logic device that balances integration density and environmental robustness.
For designs that demand scalable logic capacity, significant on-chip RAM, and flexible I/O in a surface-mount FCBGA package, this Kintex®-7 part provides a verifiable platform to support development, integration, and deployment in industrial and embedded applications.
Request a quote or submit an inquiry to receive pricing and availability for the XC7K355T-1FFG901I. Our team will respond with the information needed to evaluate this part for your design and procurement needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








