XC7K355T-1FFG901I

IC FPGA 300 I/O 901FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 26357760 356160 900-BBGA, FCBGA

Quantity 1,256 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package901-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O300Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs27825Number of Logic Elements/Cells356160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits26357760

Overview of XC7K355T-1FFG901I – Kintex®-7 FPGA, 356,160 logic elements, 900‑BBGA

The XC7K355T-1FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed for industrial-grade programmable-logic applications. It provides substantial on-chip resources—with 356,160 logic elements and approximately 26.4 Mbits of embedded memory—along with up to 300 user I/Os in a 900‑BBGA (FCBGA) package.

This device targets designs that require high logic capacity, significant embedded RAM, and a wide operating temperature range (−40 °C to 100 °C). The core supply voltage range is 0.97 V to 1.03 V and the part is RoHS compliant.

Key Features

  • Core Logic  27,825 CLBs and 356,160 logic elements provide extensive programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 26.4 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
  • I/O and Packaging  Up to 300 user I/Os in a 900‑BBGA, FCBGA package; supplier device package listed as 901‑FCBGA (31×31) to accommodate dense board layouts.
  • Power  Core supply voltage range from 0.97 V to 1.03 V for integration with regulated power systems.
  • Industrial Temperature Range  Specified operation from −40 °C to 100 °C to meet demands of temperature-varied environments.
  • Mounting and Compliance  Surface-mount device with RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

  • Industrial Automation  Use the XC7K355T-1FFG901I for programmable control, signal processing, and I/O expansion in industrial control systems, leveraging its industrial temperature rating and large logic and memory resources.
  • Embedded Systems  Implement hardware acceleration, custom peripherals, or system integration tasks where substantial on-chip RAM and logic count simplify board-level design.
  • Prototyping and System Integration  Deploy this FPGA for development platforms that require flexible logic resources and abundant I/O while maintaining surface-mount compatibility.

Unique Advantages

  • Substantial Logic Capacity: 356,160 logic elements support large-scale logic implementations and complex state machines without offloading functions to external devices.
  • Ample Embedded Memory: Approximately 26.4 Mbits of on-chip RAM reduces dependence on external memory for buffering and data storage.
  • High I/O Count: Up to 300 I/Os enable connection to many peripherals and interfaces directly from the FPGA fabric.
  • Industrial Temperature Stability: Rated from −40 °C to 100 °C for deployment in temperature-varied industrial environments.
  • Surface-Mount Package Options: 900‑BBGA (FCBGA) / supplier 901‑FCBGA (31×31) packaging supports compact, high-density board designs.
  • Regulatory Compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose XC7K355T-1FFG901I?

The XC7K355T-1FFG901I combines a large pool of logic elements, substantial embedded memory, and a high I/O count in an industrial-grade FPGA package. These documented characteristics make it suitable for engineers and procurement teams seeking a programmable logic device that balances integration density and environmental robustness.

For designs that demand scalable logic capacity, significant on-chip RAM, and flexible I/O in a surface-mount FCBGA package, this Kintex®-7 part provides a verifiable platform to support development, integration, and deployment in industrial and embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for the XC7K355T-1FFG901I. Our team will respond with the information needed to evaluate this part for your design and procurement needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up