XC7K355T-3FFG901E

The XC7K355T-3FFG901E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering high logic capacity, substantial on-chip memory, and a broad I/O complement in a ball grid array package. It is intended for designs that require large programmable logic resources combined with significant embedded RAM and many external interfaces.

Key Features

• Logic Capacity  Approximately 356,160 logic elements for implementing complex custom logic and large combinational/sequential designs.
• Embedded Memory  Approximately 26.36 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Resources  300 user I/O pins to support multiple external interfaces, parallel data paths, or high-channel aggregation.
• Power Supply  Core voltage range specified at 0.970 V to 1.03 V to match system power-rail planning.
• Package & Mounting  900-BBGA, FCBGA package (supplier package: 901-FCBGA, 31 × 31) with surface-mount mounting for compact board integration.
• Operating Range  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Leverage the large logic-element count to implement complex state machines, data-paths, and custom accelerators.
• Memory-intensive functions  Use the approximately 26.36 Mbits of embedded RAM for buffering, FIFOs, and on-chip storage to reduce external memory dependence.
• Multi-interface systems  Support systems requiring many external connections—300 I/O pins accommodate parallel buses, multiple serial interfaces, and I/O-rich peripherals.
• Board-level integration  The 901-FCBGA (31 × 31) surface-mount package facilitates compact PCB layouts for space-constrained applications.

Unique Advantages

• High logic density: Large logic-element count enables implementation of sizable custom logic blocks without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 26.36 Mbits of embedded memory reduces the need for external RAM in many designs, simplifying BOM and board complexity.
• Generous I/O count: 300 I/O pins provide flexibility for connecting numerous peripherals, sensors, and interfaces directly to the FPGA.
• Compact BGA package: 900-BBGA / 901-FCBGA (31 × 31) package balances high pin-count with a compact footprint for dense PCB assemblies.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet a range of commercial and extended-environment use cases.
• RoHS compliant: Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Why Choose XC7K355T-3FFG901E?

The XC7K355T-3FFG901E positions itself as a high-capacity Kintex®-7 FPGA well suited to designs that demand substantial programmable logic, on-chip memory, and a large number of I/O connections in a compact BGA package. Its extended-grade operating range and RoHS compliance make it appropriate for applications requiring robust thermal and environmental performance within the specified temperature window.

Choose this device when your design requires a balance of logic density, embedded RAM, and I/O richness on a surface-mount 901-FCBGA footprint, enabling consolidated functionality and a streamlined board-level implementation.

Request a quote or submit a purchasing inquiry today to receive pricing and availability for XC7K355T-3FFG901E.