XC7K355T-L2FFV901E

IC FPGA 300 I/O 901FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 26357760 356160 900-BBGA, FCBGA

Quantity 53 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package901-FCBGA (31x31)GradeExtendedOperating Temperature0°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O300Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs27825Number of Logic Elements/Cells356160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits26357760

Overview of XC7K355T-L2FFV901E – Kintex®-7 FPGA, 356,160 logic elements, 300 I/Os, 900-BBGA (FCBGA)

The XC7K355T-L2FFV901E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offering a large fabric of programmable logic and embedded memory in a high-density BGA package. It delivers 356,160 logic elements and approximately 26.36 Mbits of on-chip RAM, together with 300 user I/Os, making it suitable for designs that require significant programmable logic capacity and on-chip storage.

This device is supplied in a 900-BBGA (FCBGA) surface-mount package (supplier package: 901-FCBGA, 31×31), operates with a core voltage range of 0.97 V to 1.03 V, and is specified for extended-grade operation from 0 °C to 100 °C. It is RoHS compliant.

Key Features

  • Core Logic Capacity 356,160 logic elements to implement large-scale programmable logic and complex system functions.
  • Embedded Memory Approximately 26.36 Mbits of on-chip RAM for buffering, frame storage, and local data management.
  • I/O Resources 300 user I/Os to support extensive external interfacing and subsystem connectivity.
  • Power and Voltage Defined core supply voltage range of 0.97 V to 1.03 V to guide power system design and sequencing.
  • Package & Mounting 900-BBGA (FCBGA) in a surface-mount form factor; supplier device package listed as 901-FCBGA (31×31) for compact PCB integration.
  • Temperature & Grade Extended-grade device rated for operation from 0 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 356,160 logic elements provide substantial programmable resources for implementing complex algorithms and functions on-chip.
  • Substantial on‑chip memory: Approximately 26.36 Mbits of embedded RAM reduces reliance on external memory in many design scenarios.
  • Flexible interfacing: 300 I/Os enable broad connectivity options for peripherals, sensors, and high-pin-count subsystems.
  • Space-efficient packaging: 900-BBGA / 901-FCBGA (31×31) package supports high-density PCB layouts while remaining surface-mount compatible.
  • Clear power specification: A defined core voltage window of 0.97–1.03 V helps simplify regulator selection and power sequencing.
  • Extended-grade and RoHS compliant: Specified extended operating range and RoHS compliance address longevity and environmental requirements.

Why Choose XC7K355T-L2FFV901E?

The XC7K355T-L2FFV901E combines a large programmable fabric, significant embedded memory, and a high I/O count in a compact FCBGA package, delivering a balanced platform for designs that need considerable on-chip resources. Its defined core voltage range, extended-grade operating window, and RoHS compliance provide clear electrical, thermal, and environmental parameters for system design and procurement.

This device is well suited to engineering teams and procurement professionals seeking a high-density Kintex®-7 FPGA option with substantial logic and memory capacity, a broad I/O complement, and a compact surface-mount BGA package.

Request a quote or contact sales to discuss availability, pricing, and delivery for the XC7K355T-L2FFV901E.

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