XC7K355T-L2FFV901E
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 26357760 356160 900-BBGA, FCBGA |
|---|---|
| Quantity | 53 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 901-FCBGA (31x31) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 300 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 27825 | Number of Logic Elements/Cells | 356160 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 26357760 |
Overview of XC7K355T-L2FFV901E – Kintex®-7 FPGA, 356,160 logic elements, 300 I/Os, 900-BBGA (FCBGA)
The XC7K355T-L2FFV901E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offering a large fabric of programmable logic and embedded memory in a high-density BGA package. It delivers 356,160 logic elements and approximately 26.36 Mbits of on-chip RAM, together with 300 user I/Os, making it suitable for designs that require significant programmable logic capacity and on-chip storage.
This device is supplied in a 900-BBGA (FCBGA) surface-mount package (supplier package: 901-FCBGA, 31×31), operates with a core voltage range of 0.97 V to 1.03 V, and is specified for extended-grade operation from 0 °C to 100 °C. It is RoHS compliant.
Key Features
- Core Logic Capacity 356,160 logic elements to implement large-scale programmable logic and complex system functions.
- Embedded Memory Approximately 26.36 Mbits of on-chip RAM for buffering, frame storage, and local data management.
- I/O Resources 300 user I/Os to support extensive external interfacing and subsystem connectivity.
- Power and Voltage Defined core supply voltage range of 0.97 V to 1.03 V to guide power system design and sequencing.
- Package & Mounting 900-BBGA (FCBGA) in a surface-mount form factor; supplier device package listed as 901-FCBGA (31×31) for compact PCB integration.
- Temperature & Grade Extended-grade device rated for operation from 0 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 356,160 logic elements provide substantial programmable resources for implementing complex algorithms and functions on-chip.
- Substantial on‑chip memory: Approximately 26.36 Mbits of embedded RAM reduces reliance on external memory in many design scenarios.
- Flexible interfacing: 300 I/Os enable broad connectivity options for peripherals, sensors, and high-pin-count subsystems.
- Space-efficient packaging: 900-BBGA / 901-FCBGA (31×31) package supports high-density PCB layouts while remaining surface-mount compatible.
- Clear power specification: A defined core voltage window of 0.97–1.03 V helps simplify regulator selection and power sequencing.
- Extended-grade and RoHS compliant: Specified extended operating range and RoHS compliance address longevity and environmental requirements.
Why Choose XC7K355T-L2FFV901E?
The XC7K355T-L2FFV901E combines a large programmable fabric, significant embedded memory, and a high I/O count in a compact FCBGA package, delivering a balanced platform for designs that need considerable on-chip resources. Its defined core voltage range, extended-grade operating window, and RoHS compliance provide clear electrical, thermal, and environmental parameters for system design and procurement.
This device is well suited to engineering teams and procurement professionals seeking a high-density Kintex®-7 FPGA option with substantial logic and memory capacity, a broad I/O complement, and a compact surface-mount BGA package.
Request a quote or contact sales to discuss availability, pricing, and delivery for the XC7K355T-L2FFV901E.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








