XC7K355T-2FFG901C

The XC7K355T-2FFG901C is a Kintex®-7 Field Programmable Gate Array (FPGA) in a surface-mount FCBGA package. It delivers high logic density, significant on-chip memory, and a large I/O count for designs that require substantial programmable logic and system integration.

Designed for commercial-grade applications, the device operates over a 0 °C to 85 °C range and supports a core voltage supply range of 970 mV to 1.03 V, making it suitable for systems where compact packaging and embedded memory capacity are important design considerations.

Key Features

• Logic Capacity — 356,160 logic elements provide substantial programmable logic resources for complex digital functions and system-level integration.
• Embedded Memory — Approximately 26.36 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-hungry logic blocks.
• I/O Resources — 300 I/O pins to accommodate a wide range of external interfaces and parallel connectivity requirements.
• Package and Mounting — Surface-mount 900-BBGA FCBGA package with supplier device package listed as 901-FCBGA (31×31), enabling compact board-level integration.
• Power — Core supply range from 970 mV to 1.03 V to match system power rails and supply planning.
• Operating Range and Grade — Commercial temperature grade with an operating range of 0 °C to 85 °C, suitable for standard commercial applications.
• Regulatory Compliance — RoHS compliant, supporting lead-free assembly and environmental compliance requirements.

Typical Applications

• High-density logic integration — Implement complex digital accelerators and custom processing pipelines that require large numbers of logic elements.
• Memory-intensive designs — Use the on-chip RAM for buffering, packet storage, and real-time data handling without immediate dependence on off-chip memory.
• Multi-interface systems — Leverage 300 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single FPGA substrate.
• Compact board-level solutions — The FCBGA package supports tightly packed board layouts where surface-mount integration and space efficiency are priorities.

Unique Advantages

• High logic density: 356,160 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM and board complexity.
• Substantial embedded memory: Approximately 26.36 Mbits of on-chip RAM minimizes reliance on external memory for many buffer and storage needs.
• Extensive I/O capability: 300 I/Os provide flexibility for complex connectivity scenarios and support diverse interface requirements.
• Compact FCBGA packaging: The 900-BBGA / 901-FCBGA (31×31) package supports high-density board designs and efficient routing.
• Commercial temperature grade: Operation from 0 °C to 85 °C aligns with standard commercial deployment and testing profiles.
• RoHS compliant: Meets lead‑free manufacturing requirements for environmentally conscious production.

Why Choose XC7K355T-2FFG901C?

The XC7K355T-2FFG901C balances high logic capacity, significant embedded memory, and ample I/O in a compact FCBGA package, making it a practical option for commercial designs that require consolidation of complex digital functions. Its specified voltage supply range and commercial operating temperature support predictable integration into standard system power and thermal designs.

This device is well suited for engineers and teams building systems that demand large programmable logic resources, on-chip RAM for immediate data handling, and a high count of external interfaces while maintaining a compact, surface-mount form factor.

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