XC7K355T-1FFG901C

The XC7K355T-1FFG901C is a Kintex®-7 Field Programmable Gate Array from AMD, offered in a 900‑BBGA FCBGA package. It provides a large logic fabric and on‑chip memory combined with a broad I/O count for commercial‑grade, surface‑mount applications.

With 356,160 logic elements and approximately 26.36 Mbits of embedded memory, this device is intended for designs that require significant programmable logic capacity, substantial embedded RAM, and flexible I/O in a compact FCBGA footprint.

Key Features

• Core Logic  Provides 356,160 logic elements (cells) to implement complex, reconfigurable digital functions.
• Embedded Memory  Approximately 26.36 Mbits of on‑chip RAM to support buffering, FIFOs, and data path storage directly inside the FPGA fabric.
• I/O Capacity  300 user I/O pins available for interfacing with external devices and high‑density system connections.
• Power  Core voltage supply range specified at 0.970 V to 1.030 V for the device core domain.
• Package & Mounting  Supplied in a 900‑BBGA FCBGA package (901‑FCBGA, 31×31 mm) designed for surface‑mount PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic implementations  Use the large logic element count and embedded memory to implement custom digital processing and control functions.
• Interfaces and bridging  Leverage 300 I/O pins for multi‑interface connectivity and protocol bridging in system designs.
• Compact board‑level designs  The 901‑FCBGA (31×31) package supports surface‑mount assembly where board space and integration density matter.

Unique Advantages

• High logic density: 356,160 logic elements enable complex, large‑scale programmable designs without external logic expansion.
• Substantial on‑chip RAM: Approximately 26.36 Mbits of embedded memory reduces dependence on external memory for many data buffering and processing tasks.
• Extensive I/O availability: 300 user I/Os provide flexibility for multi‑channel interfaces and high‑pin‑count designs.
• Compact FCBGA packaging: 900‑BBGA / 901‑FCBGA (31×31) package delivers high integration density in a surface‑mount form factor.
• Defined commercial operating range: Rated for 0 °C to 85 °C to match standard commercial system environments.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance.

Why Choose XC7K355T-1FFG901C?

The XC7K355T-1FFG901C combines a high number of logic elements, significant embedded memory, and a large I/O complement in a compact 900‑BBGA FCBGA package, making it suitable for commercial designs that need integrated programmable logic and on‑chip storage. Its specified core voltage range and surface‑mount package enable straightforward integration into modern PCB assemblies.

As an AMD Kintex®‑7 device, this FPGA is positioned for engineers and procurement teams seeking a high‑capacity, commercially graded programmable logic solution that balances integration density and on‑chip resources for demanding board‑level applications.

Request a quote or submit an inquiry for XC7K355T-1FFG901C to receive pricing and availability information.