XC7K355T-1FF901I

The XC7K355T-1FF901I is a Kintex-7 series Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 900-BBGA FCBGA package (supplier package: 901-FCBGA, 31×31). It delivers high logic density and on-chip memory in a surface-mount form factor designed for industrial-grade applications.

With 356,160 logic elements, approximately 26.36 Mbits of embedded memory and 300 general-purpose I/O pins, this device targets designs that require substantial programmable logic, on-chip storage and a broad I/O count within an industrial temperature range.

Key Features

• High Logic Capacity  Provides 356,160 logic elements for complex programmable logic implementations.
• Embedded Memory  Approximately 26.36 Mbits of on-chip RAM to support buffering, state storage and intermediate data processing.
• I/O Resources  300 I/O pins support broad interfacing requirements to external peripherals, sensors and subsystems.
• Package & Mounting  900-BBGA FCBGA package (supplier package 901-FCBGA, 31×31) in a surface-mount form factor for compact board-level integration.
• Power Supply  Core voltage supply range from 0.970 V to 1.03 V to guide power delivery design and voltage regulation.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance  RoHS-compliant construction.

Typical Applications

• Industrial Automation  Use for programmable control, signal processing and interface bridging in industrial equipment where an industrial temperature rating is required.
• Communications Equipment  Deploy for logic-intensive packet processing, protocol handling and I/O aggregation leveraging high logic density and abundant I/O.
• High-density Embedded Processing  Integrate on boards that require substantial on-chip memory and logic resources in a compact FCBGA package.
• Prototyping and System Development  Suitable for development platforms that need a large, reprogrammable logic fabric with significant embedded RAM and I/O capability.

Unique Advantages

• High integration of programmable logic: 356,160 logic elements reduce the need for multiple discrete logic devices and simplify system architecture.
• Significant on-chip RAM: Approximately 26.36 Mbits of embedded memory supports buffering and local data storage without external memory in some use cases.
• Ample I/O capacity: 300 I/O pins provide flexible connectivity for sensors, peripherals and external buses.
• Industrial-grade thermal range: −40 °C to 100 °C rating enables deployment in demanding environments.
• Compact BGA footprint: 901-FCBGA (31×31) packaging allows a balance of density and board-level serviceability in surface-mount assemblies.
• Controlled core voltage window: 0.970 V–1.03 V supply range supports precise power-supply design and stability for core logic.

Why Choose XC7K355T-1FF901I?

The XC7K355T-1FF901I combines high logic capacity, substantial embedded memory and a large I/O complement in a compact FCBGA package, making it well-suited for industrial applications and other designs that require dense programmable logic and robust thermal performance. Manufactured by AMD and RoHS-compliant, it provides a platform-level solution for complex, reprogrammable system designs.

This device is appropriate for engineers and procurement teams building systems that demand scalable logic resources, on-chip RAM for data handling, and a device qualified for operation across an industrial temperature range.

Request a quote or contact sales to discuss availability, lead times and pricing for the XC7K355T-1FF901I.